[en] The welding of Al and Cu is considered as difficult due to the formation of intermetallic compounds, which cause a brittle joint with increased electrical resistance. This paper investigates etching techniques that were used to contrast the intermetallic compounds for optical microscope analysis. A 0.5 mm AA-1050 sheet was welded to a 0.5 mm SF-Cu sheet in overlap configuration. The cross sections were etched by using 17 different reagents, including common Al-grade 2xxx etchants, Al-bronze etchants, and specific IMC etchants. A complete microstructural characterization, including the formation of intermetallic compounds, is presented. The experimental result showed that a clear distinction of metallurgic structures is possible, thus enabling a more detailed analysis of Al-Cu welds. It was found that etchants #09, #14, and #16 revealed best the four different intermetallic compounds θ-Al2Cu, η-AlCu, ζ-Al3Cu4, and γ-Al4Cu9.