Reference : Lifetime prediction for solder joints with the extended finite element method

	Document type :	Scientific congresses, symposiums and conference proceedings : Paper published in a journal
	Discipline(s) :	Engineering, computing & technology : Multidisciplinary, general & others
	Focus Areas :	Computational Sciences
	To cite this reference:	http://hdl.handle.net/10993/34902

Title :	Lifetime prediction for solder joints with the extended finite element method
Language :	English
Author, co-author :	Menk, Alexander [Robert Bosch GmbH, P.O. Box 30 02 40, 70442 Stuttgart, Germany, Glasgow University, Department of Civil Engineering, Glasgow G12 8LT, United Kingdom]
	Pearce, Chris J. [Glasgow University, Department of Civil Engineering, Glasgow G12 8LT, United Kingdom]
	Lanier, Olivier [Robert Bosch GmbH, P.O. Box 30 02 40, 70442 Stuttgart, Germany]
	Simpson, Robert [Cardiff University, Institute of Theoretical, Applied and Computational Mechanics, Cardiff CF24 3AA, United Kingdom]
	Bordas, Stéphane [University of Luxembourg > Faculty of Science, Technology and Communication (FSTC) > Engineering Research Unit >]
Publication date :	2011
Journal title :	Proceedings of 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011
Peer reviewed :	Yes
Audience :	International
Event name :	2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011
Event date :	18 April 2011 through 20 April 2011
Event place (city) :	Linz
Keywords :	[en] Average lifetime ; Crack growth ; Crack growth simulation ; Crack length ; Experimental data ; Extended finite element method ; Failure Probability ; Lifetime prediction ; Mean values ; Microstructural features ; Random microstructure ; Semi-empirical methods ; Solder joints ; Standard deviation ; Structural problems ; Crack propagation ; Cracks ; Experiments ; Forecasting ; Microelectronics ; Microstructural evolution ; Microsystems ; Statistics ; Finite element method
Abstract :	[en] Predicting the lifetime of solder joints undergoing thermal cycling is crucial for the electronics industry in order to guarantee a certain performance of their products in the field. Semi-empirical methods are often used to predict the average lifetime of the critical joints. However, to get a reliable failure probability the standard deviation must also be addressed. The deviation of the lifetime from the mean value is a consequence of the variation in microstructure found in actual joints. We therefore propose a new methodology that calculates crack growth based on microstructural features of the joint. A series of random microstructures is generated. Crack growth calculations are performed for each of these structures. The structural problem is solved numerically with the extended finite element method which allows a complete automation of the process. The mean crack length and standard deviation are calculated from the crack growth simulations and the result is compared to experimental data.
Permalink :	http://hdl.handle.net/10993/34902
DOI :	10.1109/ESIME.2011.5765773

	File(s) associated to this reference
	Fulltext file(s): File Commentary Version Size Access Limited access Lifetime Prediction for Solder Joints .pdf Publisher postprint 1.92 MB Request a copy

All documents in ORBi^lu are protected by a user license.

 

University of Luxembourg Library |  Feedback |  Legal notices Site Map