Article (Scientific journals)
Resistivity scaling in metallic thin films and nanowires due to grain boundary and surface roughness scattering
Moors, Kristof; Sorée, B.; Magnus, W.
2017In Microelectronic Engineering, 167, p. 37-41
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Keywords :
Electron scattering; Electron transport; Fermi's golden rule; Grain boundaries; Nanowires; Resistivity scaling; Semiclassical Boltzmann equation; Surface roughness; Thin films; Boltzmann equation; Electron transport properties; Quantum theory; Surface scattering; Boltzmann transport equation; Fitting parameters; Metallic thin films; Quantum mechanical; Statistical properties; Surface roughness scattering
Abstract :
[en] A modeling approach, based on an analytical solution of the semiclassical multi-subband Boltzmann transport equation, is presented to study resistivity scaling in metallic thin films and nanowires due to grain boundary and surface roughness scattering. While taking into account the detailed statistical properties of grains, roughness and barrier material as well as the metallic band structure and quantum mechanical aspects of scattering and confinement, the model does not rely on phenomenological fitting parameters.
Disciplines :
Physics
Identifiers :
eid=2-s2.0-84992372777
Author, co-author :
Moors, Kristof ;  University of Luxembourg > Faculty of Science, Technology and Communication (FSTC) > Physics and Materials Science Research Unit
Sorée, B.;  Physics Modeling and Simulation (MSP), IMEC, Kapeldreef 75, Leuven, Belgium, University of Antwerp, Physics Department, Groenenborgerlaan 171, Antwerpen, Belgium, KU Leuven, Electrical Engineering (ESAT) Department, Kasteelpark Arenberg 10, Leuven, Belgium
Magnus, W.;  Physics Modeling and Simulation (MSP), IMEC, Kapeldreef 75, Leuven, Belgium, University of Antwerp, Physics Department, Groenenborgerlaan 171, Antwerpen, Belgium
External co-authors :
yes
Language :
English
Title :
Resistivity scaling in metallic thin films and nanowires due to grain boundary and surface roughness scattering
Publication date :
2017
Journal title :
Microelectronic Engineering
ISSN :
0167-9317
Publisher :
Elsevier B.V.
Volume :
167
Pages :
37-41
Peer reviewed :
Peer Reviewed verified by ORBi
Focus Area :
Physics and Materials Science
Available on ORBilu :
since 15 November 2017

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