Impact of thermal annealing on graphene devices encapsulated in hexagonal boron nitride

Reference : Impact of thermal annealing on graphene devices encapsulated in hexagonal boron nitride


	Document type :	Scientific journals : Article
	Discipline(s) :	Physical, chemical, mathematical & earth Sciences : Physics
	To cite this reference:	http://hdl.handle.net/10993/20893

Title :	Impact of thermal annealing on graphene devices encapsulated in hexagonal boron nitride
Language :	English
Author, co-author :	Engels, Stephan [> >]
	Terrés, Bernat [> >]
	Klein, Felix [> >]
	Reichardt, Sven [University of Luxembourg > Faculty of Science, Technology and Communication (FSTC) > Physics and Materials Science Research Unit]
	Goldsche, Matthias [> >]
	Kuhlen, Sebastian [> >]
	Watanabe, Kenji [> >]
	Taniguchi, Takashi [> >]
	Stampfer, Christoph [> >]
Publication date :	29-Sep-2014
Journal title :	Physica Status Solidi B. Basic Research
Publisher :	Wiley
Volume :	251
Issue/season :	12
Pages :	2545--2550
Peer reviewed :	Yes (verified by ORBi^lu)
ISSN :	0370-1972
e-ISSN :	1521-3951
City :	Berlin
Country :	Germany
Permalink :	http://hdl.handle.net/10993/20893
DOI :	10.1002/pssb.201451384

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