[en] Determining the lifetime of solder joints subjected to thermomechanical loads is crucial to guarantee the quality of electronic devices. The fatigue process is heavily dependent on the microstructure of the joints. We present a new methodology to determine the lifetime of the joints based on microstructural phenomena. Random microstructures are generated to capture the statistical variety of possible microstructures and crack growth calculations are performed. The extended finite element method is used to solve the structural problem numerically which allows a complete automation of the process. Numerical examples are given and compared to experimental data.
Disciplines :
Engineering, computing & technology: Multidisciplinary, general & others
Author, co-author :
Menk, Alexander; Glasgow University, Department of Civil Engineering, Glasgow G12 8LT, United Kingdom, Robert Bosch GmbH, P.O. Box 300240, 70442 Stuttgart, Germany
Bordas, Stéphane ; University of Luxembourg > Faculty of Science, Technology and Communication (FSTC) > Engineering Research Unit
External co-authors :
yes
Language :
English
Title :
Crack growth calculations in solder joints based on microstructural phenomena with X-FEM
Publication date :
2011
Journal title :
Computational Materials Science
ISSN :
0927-0256
Publisher :
Elsevier, Netherlands
Volume :
50
Issue :
3
Pages :
1145-1156
Peer reviewed :
Peer Reviewed verified by ORBi
Focus Area :
Computational Sciences
Funders :
Robert Bosch GmbH Stuttgart-Schwieberdingen Royal Academy of Engineering and the Leverhulme Trust: Senior Research Fellowship EPSRC support under Grant EP/G042705/1 ‘‘Increased Reliability for Industrially Relevant Automatic Crack Growth Simulation with the eXtended Finite Element Method’’
