Reference : Crack growth calculations in solder joints based on microstructural phenomena with X-FEM
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Computational Sciences
Crack growth calculations in solder joints based on microstructural phenomena with X-FEM
Menk, Alexander [Glasgow University, Department of Civil Engineering, Glasgow G12 8LT, United Kingdom, Robert Bosch GmbH, P.O. Box 300240, 70442 Stuttgart, Germany]
Bordas, Stéphane mailto [University of Luxembourg > Faculty of Science, Technology and Communication (FSTC) > Engineering Research Unit >]
Computational Materials Science
Yes (verified by ORBilu)
[en] Crack growth ; Enrichment ; Microstructure ; Polycrystal fracture ; Solder joint ; X-FEM ; Electronic device ; Experimental data ; Extended finite element method ; Fatigue process ; Microstructural phenomenon ; Numerical example ; Random microstructure ; Solder joints ; Structural problems ; Thermo mechanical loads ; Cracks ; Finite element method ; Fracture ; Polycrystals ; Crack propagation
[en] Determining the lifetime of solder joints subjected to thermomechanical loads is crucial to guarantee the quality of electronic devices. The fatigue process is heavily dependent on the microstructure of the joints. We present a new methodology to determine the lifetime of the joints based on microstructural phenomena. Random microstructures are generated to capture the statistical variety of possible microstructures and crack growth calculations are performed. The extended finite element method is used to solve the structural problem numerically which allows a complete automation of the process. Numerical examples are given and compared to experimental data.
Robert Bosch GmbH Stuttgart-Schwieberdingen ; Royal Academy of Engineering and the Leverhulme Trust: Senior Research Fellowship ; EPSRC support under Grant EP/G042705/1 ‘‘Increased Reliability for Industrially Relevant Automatic Crack Growth Simulation with the eXtended Finite Element Method’’
Researchers ; Professionals ; Students ; General public ; Others

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