[en] Determining the lifetime of solder joints subjected to thermomechanical loads is crucial to guarantee the quality of electronic devices. The fatigue process is heavily dependent on the microstructure of the joints. We present a new methodology to determine the lifetime of the joints based on microstructural phenomena. Random microstructures are generated to capture the statistical variety of possible microstructures and crack growth calculations are performed. The extended finite element method is used to solve the structural problem numerically which allows a complete automation of the process. Numerical examples are given and compared to experimental data.
Disciplines :
Ingénierie, informatique & technologie: Multidisciplinaire, généralités & autres
Auteur, co-auteur :
Menk, Alexander; Glasgow University, Department of Civil Engineering, Glasgow G12 8LT, United Kingdom, Robert Bosch GmbH, P.O. Box 300240, 70442 Stuttgart, Germany
BORDAS, Stéphane ; University of Luxembourg > Faculty of Science, Technology and Communication (FSTC) > Engineering Research Unit
Co-auteurs externes :
yes
Langue du document :
Anglais
Titre :
Crack growth calculations in solder joints based on microstructural phenomena with X-FEM
Date de publication/diffusion :
2011
Titre du périodique :
Computational Materials Science
ISSN :
0927-0256
eISSN :
1879-0801
Maison d'édition :
Elsevier, Pays-Bas
Volume/Tome :
50
Fascicule/Saison :
3
Pagination :
1145-1156
Peer reviewed :
Peer reviewed vérifié par ORBi
Focus Area :
Computational Sciences
Organisme subsidiant :
Robert Bosch GmbH Stuttgart-Schwieberdingen Royal Academy of Engineering and the Leverhulme Trust: Senior Research Fellowship EPSRC support under Grant EP/G042705/1 ‘‘Increased Reliability for Industrially Relevant Automatic Crack Growth Simulation with the eXtended Finite Element Method’’
