Sensitivity analysis and shape optimization using isogeomgetric boundary element methods

Scientific Conference (2014, July)

Sensitivity Analysis and Shape Optimisation through a T-spline Isogeometric Boundary Element Method

Scientific Conference (2013, March 25)

Sensitivity Analysis and Shape Optimisation through a T-spline Isogeometric Boundary Element Method

Scientific Conference (2013, March)

Lifetime prediction for solder joints with the extended finite element method

in Proceedings of 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 (2011)

Predicting the lifetime of solder joints undergoing thermal cycling is crucial for the electronics industry in order to guarantee a certain performance of their products in the field. Semi-empirical ... [more ▼]

Predicting the lifetime of solder joints undergoing thermal cycling is crucial for the electronics industry in order to guarantee a certain performance of their products in the field. Semi-empirical methods are often used to predict the average lifetime of the critical joints. However, to get a reliable failure probability the standard deviation must also be addressed. The deviation of the lifetime from the mean value is a consequence of the variation in microstructure found in actual joints. We therefore propose a new methodology that calculates crack growth based on microstructural features of the joint. A series of random microstructures is generated. Crack growth calculations are performed for each of these structures. The structural problem is solved numerically with the extended finite element method which allows a complete automation of the process. The mean crack length and standard deviation are calculated from the crack growth simulations and the result is compared to experimental data. [less ▲]