![]() Wolter, Max ![]() in Physica Status Solidi C. Current Topics in Solid State Physics (2017), 14, no 6 Detailed reference viewed: 241 (15 UL)![]() Molina-Sanchez, Alejandro ![]() in Physica Status Solidi C. Current Topics in Solid State Physics (2012), 9(3-4), 1001--1004 In this work, we study theoretically and experimentally the influence of the surface electron accumulation on the optical properties of InN nanowires. For this purpose, the photoluminescence and ... [more ▼] In this work, we study theoretically and experimentally the influence of the surface electron accumulation on the optical properties of InN nanowires. For this purpose, the photoluminescence and photoluminescence excitation spectra have been measured for a set of self-assembled InN NWs grown under different conditions. The photoluminescence excitation experimental lineshapes have been reproduced by a self-consistent calculation of the absorption in a cylindrical InN nanowires. With the self-consistent model we can explore how the optical absorption depends on nanowires radius and doping concentration. Our model solves the Schrödinger equation for a cylindrical nanowire of infinite length, assuming a parabolic conduction band. The columnar geometry introduces effects in both the electron density and in the self-consistent conduction band profile, with no equivalence in planar layer. On the other hand, the differences in the photoluminescence excitation spectra are related to the inhomogeneous electron distribution inside the nanowires, caused by a bulk donor concentration and a two-dimensional density of ionized surface states. For nanowire radii larger than 30 nm, such concentrations modify the absorption edge and the lineshape, respectively, and can be determined from the comparison with the experimental data (© 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [less ▲] Detailed reference viewed: 294 (1 UL)![]() ; ; et al in Physica Status Solidi C. Current Topics in Solid State Physics (2012), 9(3-4), 911-914 The residual strain in AlGaN/GaN heterostructure field-effect transistors (HFETs) with recessed gates and their non-recessed counterparts were investigated by micro photoluminescence measurements (μ-PL ... [more ▼] The residual strain in AlGaN/GaN heterostructure field-effect transistors (HFETs) with recessed gates and their non-recessed counterparts were investigated by micro photoluminescence measurements (μ-PL). It is found that strain relaxation accounts for the observed sheet carrier density reduction after gate recessing. The usefulness of the method for device processing optimization is demonstrated. © 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. [less ▲] Detailed reference viewed: 165 (2 UL)![]() ; ; et al in Physica Status Solidi C. Current Topics in Solid State Physics (2010), 7(2), 386-389 Detailed reference viewed: 133 (0 UL)![]() ; ; et al in Physica Status Solidi C. Current Topics in Solid State Physics (2007), 4 (2007) We report on AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOSHFETs) with MOCVD deposited Al2O3 as a gate oxide. Properties of MOSHFETs with 9 nm and 14 nm thick Al2O3 are ... [more ▼] We report on AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOSHFETs) with MOCVD deposited Al2O3 as a gate oxide. Properties of MOSHFETs with 9 nm and 14 nm thick Al2O3 are compared with conventional HFETs prepared simultaneously on the same layer structure. Lower gate leakage current (~10−5 A/mm at −10 V) and higher saturated drain current (up to 40%) are obtained for MOSHFETs than those for HFETs. In contradiction to previously reported data, the extrinsic transconductance for MOSHFETs is also higher (up to 37% of peak values) than that for HFET. This indicates on semi-conductive rather than insulating properties of Al2O3 gate oxide. Pulsed I−V measurements (pulse width 1 μs) yielded lower but still measurable current collapse in MOSHFETs compared to HFETs. Nevertheless, obtained results show that Al2O3 gate oxide, after optimising its microstructure and thickness, can be preferable for the preparation of AlGaN/GaN MOSHFETs. [less ▲] Detailed reference viewed: 146 (0 UL)![]() Marso, Michel ![]() in Physica Status Solidi C. Current Topics in Solid State Physics (2006), 3(6), 2261-2264 The optoelectronic properties of MSM diodes that are based on an AlGaN/GaN HEMT layer system are investigated as function of the applied bias. For low voltages, the two-dimensional electron gas acts as a ... [more ▼] The optoelectronic properties of MSM diodes that are based on an AlGaN/GaN HEMT layer system are investigated as function of the applied bias. For low voltages, the two-dimensional electron gas acts as a barrier for the depletion layer. Therefore, only the upper AlGaN barrier layer contributes to the photocurrent. In the high voltage regime the depletion region penetrates the GaN buffer that adds the spectral responsivity of GaN to the pure AlGaN behaviour in the low voltage regime. The ratio of the responsivities at 350 nm and 300 nm wavelength can be switched from 0.01 at 2.5 V to 0.8 at 4 V bias. This property makes the MSM-2DEG a candidate for use as two-color photodetector. Device fabrication uses standard HEMT processing steps, allowing integration in HEMT circuits without the need of sophisticated growth or etching techniques. [less ▲] Detailed reference viewed: 114 (0 UL)![]() Marso, Michel ![]() in Physica Status Solidi C. Current Topics in Solid State Physics (2005), 2(7), 2611-2614 We have fabricated undoped as well as modulation-doped AlGaN/GaN HEMTs on SiC substrate. The influence of the carrier supply layer on device performance is investigated by Hall, channel conductivity ... [more ▼] We have fabricated undoped as well as modulation-doped AlGaN/GaN HEMTs on SiC substrate. The influence of the carrier supply layer on device performance is investigated by Hall, channel conductivity, small signal RF and delay time evaluation. While the doping layer improves the DC performance it degrades the RF behaviour of the device with the highest carrier supply doping of 5x1018 cm–3. The channel conductivity measurements show identical dependence of the mobility on carrier concentration for all samples. The saturation velocity, extracted by evaluation of the total delay time as function of the inverse drain current, decreases from 0.86x107 cm/s for the undoped device to 0.7x107 cm/s for the highest doped HEMT. This result shows that the degradation of RF performance is due to the reduction of the effective saturation velocity caused by the carrier supply layer. [less ▲] Detailed reference viewed: 140 (0 UL)![]() ; ; Marso, Michel ![]() in Physica Status Solidi C. Current Topics in Solid State Physics (2005), 2(7), 2676-2679 The performance of unpassivated GaN/AlGaN/GaN/SiC HEMTs with intentionally undoped and doped barrier structures are extensively studied. No drain current dispersion between DC and 50 ns pulses on doped ... [more ▼] The performance of unpassivated GaN/AlGaN/GaN/SiC HEMTs with intentionally undoped and doped barrier structures are extensively studied. No drain current dispersion between DC and 50 ns pulses on doped devices and less than 10% dispersion on undoped ones is observed. The full (100%) current recovery on undoped sample was measured in 1μs. The drain current extrapolated from 2 GHz large signal measurements corresponds to the measured static drain current confirming negligible current dispersion of our devices. Insignificant (<5 %) degradation in overall device performance parameters (IDs, gm, fT, fmax, Pout) on both undoped and doped structures after 12-hour-long bias stress was obtained. These results documents that suitable device performances can be obtained also on unpassivated GaN-based HEMTs. [less ▲] Detailed reference viewed: 91 (0 UL)![]() ; ; et al in Physica Status Solidi C. Current Topics in Solid State Physics (2005), 2(7), 2619-2622 This paper reports on properties of intentionally undoped AlGaN/GaN/sapphire-based high electron mobility transistors (HEMTs) before and after passivation with SiO2 and Si3N4. Our results indicate that ... [more ▼] This paper reports on properties of intentionally undoped AlGaN/GaN/sapphire-based high electron mobility transistors (HEMTs) before and after passivation with SiO2 and Si3N4. Our results indicate that the DC performance of the AlGaN/GaN HEMTs improved significantly as the stress in the passivation layer increased from compressive to tensile. It corresponded to changes in the sheet carrier concentration. Unlike the DC properties, RF properties of the HEMTs were less sensitive to the stress. [less ▲] Detailed reference viewed: 116 (0 UL)![]() ; Marso, Michel ![]() in Physica Status Solidi C. Current Topics in Solid State Physics (2003), (7), 2360-2363 Deep levels in AlGaN/GaN heterostructures are known to be responsible for trapping processes like current collapse or dispersion. In order to investigate these processes we performed different ... [more ▼] Deep levels in AlGaN/GaN heterostructures are known to be responsible for trapping processes like current collapse or dispersion. In order to investigate these processes we performed different measurements on HEMTs fabricated with heterostructures grown on silicon substrate. First by photoionization spectroscopy we found three different traps with activation energies of about 2.1 eV, 2.9 eV and 3.2 eV. Secondly, the temperature dependent relaxation of the drain current was investigated by the backgating current deep level transient spectroscopy (DLTS) method. Hereby we detected majority and minority carrier traps in the GaN buffer at the energies EV + 0.41 eV and EC – 0.55 eV, respectively. The latter energy can be attributed to the well known “E2” level in GaN. [less ▲] Detailed reference viewed: 107 (1 UL)![]() ; ; Marso, Michel ![]() in Physica Status Solidi C. Current Topics in Solid State Physics (2002), (1), 82-85 Deep-level defects and surface states are supposed to be responsible for the limitation of AlGaN/GaN high electron mobility transistor (HEMT) performance. In order to investigate the influence of these ... [more ▼] Deep-level defects and surface states are supposed to be responsible for the limitation of AlGaN/GaN high electron mobility transistor (HEMT) performance. In order to investigate the influence of these traps, photoionization spectroscopy was used to study doped and undoped HEMTs grown on sapphire in different metalorganic vapour-phase epitaxy reactors. This measurement technique is based on the optical reversion of the current collapse and it allows one to determine photoionization cross-sections of the participating traps. For doped and undoped HEMTs nearly the same two defect levels with excitation energies of 3.2 eV and 2.9 eV were determined. By varying the source–gate voltage it was found that the photoionization cross-section is reduced for positive gate bias, i.e. the virtual gate on the gate–drain access region is partially neutralized due to the removal of trapped electrons from surface states. [less ▲] Detailed reference viewed: 99 (0 UL)![]() Marso, Michel ![]() in Physica Status Solidi C. Current Topics in Solid State Physics (2002), (1), 65-68 The influence of a substrate voltage on the dc characteristics of an AlGaN/GaN HEMT on silicon (111) substrate is investigated. This effect, known as backgating, is used to study traps that are located ... [more ▼] The influence of a substrate voltage on the dc characteristics of an AlGaN/GaN HEMT on silicon (111) substrate is investigated. This effect, known as backgating, is used to study traps that are located between substrate and 2DEG channel. The transient of the drain current after applying a negative substrate voltage is evaluated for measurements with and without illumination. Several trap contributions are resolved by measurements at different photon energies. A photocurrent is observed up to 600 nm wavelength. Up to this wavelength the backgating effect can be compensated and the drain current restored by a short light pulse. The experiments are performed on completed HEMTs, allowing investigation of the influence of device fabrication technology. [less ▲] Detailed reference viewed: 122 (3 UL) |
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