References of "Proceedings of 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009"
     in
Bookmark and Share    
Full Text
Peer Reviewed
See detailInfluence of the microstructure on the stress state of solder joints dusing thermal cycling
Menk, A.; Bordas, Stéphane UL

in Proceedings of 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 (2009)

The lifetime of a solder joint is mainly determined by its creep behaviour. Creep arises from the stresses inside the solder joints as a consequence of the thermomechanical mismatch of the board and the ... [more ▼]

The lifetime of a solder joint is mainly determined by its creep behaviour. Creep arises from the stresses inside the solder joints as a consequence of the thermomechanical mismatch of the board and the substrate. The stress state is heavily influenced by the anisotropy of tin. To understand the damage process in solder joints, the influence of the anisotropic microstructure must be understood. In this paper the influence of different grain sizes, shapes and orientations on the stress state is evaluated, based on numerical experiments. [less ▲]

Detailed reference viewed: 63 (2 UL)