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See detailFinite Size Effects in Highly Scaled Ruthenium Interconnects
Dutta, Shibesh; Moors, Kristof UL; Vandemaele, Michiel et al

in IEEE Electron Device Letters (2018)

Ru has been considered a candidate to replace Cu-based interconnects in VLSI circuits. Here, a methodology is proposed to predict the resistivity of (Ru) interconnects. First, the dependence of the Ru ... [more ▼]

Ru has been considered a candidate to replace Cu-based interconnects in VLSI circuits. Here, a methodology is proposed to predict the resistivity of (Ru) interconnects. First, the dependence of the Ru thin film resistivity on the film thickness is modeled by the semiclassical Mayadas-Shatzkes (MS) approach. The fitting parameters thus obtained are then used as input in a modified MS model for nanowires to calculate wire resistivities. Predicted experimental resistivities agreed within about 10%. The results further indicate that grain boundary scattering was the dominant scattering mechanism in scaled Ru interconnects. [less ▲]

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See detailComparison of AlGaN/GaN MSM Varactor Diodes Based on HFET and MOSHFET Layer Structures
Marso, Michel UL; Fox, A.; Heidelberger, G. et al

in IEEE Electron Device Letters (2006), 27

In this letter, the performance of AlGaN/GaN-based metal–semiconductor–metal (MSM) varactor diodes based on HFET and MOSHFET layer systems is investigated. Passivated HFET MSM devices are coated with a 10 ... [more ▼]

In this letter, the performance of AlGaN/GaN-based metal–semiconductor–metal (MSM) varactor diodes based on HFET and MOSHFET layer systems is investigated. Passivated HFET MSM devices are coated with a 10-nm-thick SiO2 layer between the electrodes; in MOSHFET-based diodes, this layer is also used as an insulator underneath the gate. Device fabrication uses standard HFET fabrication technology, allowing easy integration in monolithic microwave integrated circuits. Devices with different electrode geometry are characterized by direct current and by S-parameter measurements up to 50 GHz. The HFET-based varactors show capacitance ratios up to 14 and cutoff frequencies up to 74 GHz. The MOSHFET-based devices, on the other hand, show lower capacitance ratios and poorer stability because of the insulation layer between electrodes and semiconductor. [less ▲]

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See detailAlGaN/GaN HEMTs on (111) Silicon Substrates
Javorka, P.; Alam, A.; Wolter, M. et al

in IEEE Electron Device Letters (2002), 23(2002), 4-6

AlGaN/GaN HEMTs on silicon substrates have been fabricated and their static and small-signal RF characteristics investigated. The AlGaN/GaN material structures were grown on (111) p-Si by LP-MOVPE ... [more ▼]

AlGaN/GaN HEMTs on silicon substrates have been fabricated and their static and small-signal RF characteristics investigated. The AlGaN/GaN material structures were grown on (111) p-Si by LP-MOVPE. Devices exhibit a saturation current of 0.91 A/mm, a good pinchoff and a peak extrinsic transconductance of 122 mS/mm. A unity current gain frequency of 12.5 GHz and fmax/fT=0.83 were obtained. The highest saturation current reported so far, static output characteristics of up to 20 V and breakdown voltage at pinchoff higher than 40 V demonstrate that the devices are capable of handling 16 W/mm static heat dissipation. [less ▲]

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See detail0.1 µm T-gate Al-free InP/InGaAs/InP pHEMTs for W-Band Applications Using a Nitrogen Carrier for LP-MOCVD Growth
Schimpf, K.; Sommer, M.; Horstmann, M. et al

in IEEE Electron Device Letters (1997), 18

We report on the dc and RF performance of HEMT’s based on the Al-free material system InP/InGaAs/InP. These structures were grown by LP-MOCVD using a nitrogen carrier. The influence of gate length and ... [more ▼]

We report on the dc and RF performance of HEMT’s based on the Al-free material system InP/InGaAs/InP. These structures were grown by LP-MOCVD using a nitrogen carrier. The influence of gate length and channel composition on the performance of these devices is investigated.We demonstrate that optimum dc and RF performance using highly strained channels can be obtained only if additional composite channels are grown. The cutoff frequencies fT =160 GHz and fmax=260 GHz for a 0.1- um T-gate device indicate the suitability of our devices for W-Band applications. [less ▲]

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