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See detailNew approaches for growth control of GaN-based HEMT structure
Hardtdegen, H.; Steins, R.; Kaluza, N. et al

in Applied Physics A : Materials Science & Processing (2007), 87(3), 491-498

This paper reports on new approaches for growth control of GaN-based heterostructures for high frequency and high power application. First in situ methods are presented and their further development ... [more ▼]

This paper reports on new approaches for growth control of GaN-based heterostructures for high frequency and high power application. First in situ methods are presented and their further development discussed [1]. The development leads to a greatly improved observation of growth parameter influences in the MOVPE of GaN. A new growth process is introduced which enhances growth reproducibility [2]. This new growth process is then optimized with respect to the envisaged application. To this end process modeling will be employed. The application envisaged is the AlxGa1−xN/GaNhigh electron mobility transistor (HEMT). At last device results will be presented. All in all it will be shown how fundamental research can drive technology and how basic knowledge can be employed forprocess development with respect to device applications. [less ▲]

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See detailTechnology related issues regarding fabrication of AlGaN/GaN-based MOSHFETs with GdScO3 as dielectric,
Heidelberger, G.; Roeckerath, M.; Steins, R. et al

in Proc. 6th Intern. Conf. Advanced Semicon. Dev. & Microsystems ASDAM’06 (2006)

Starting out from our well established process for AlGaN/GaN HFETs we discuss ways to enrich the process in order to fabricate Metal-Oxide-Semiconductor HFETs (MOSHFETs) with a Gadolinium Scandate (GdScO3 ... [more ▼]

Starting out from our well established process for AlGaN/GaN HFETs we discuss ways to enrich the process in order to fabricate Metal-Oxide-Semiconductor HFETs (MOSHFETs) with a Gadolinium Scandate (GdScO3) insulation layer. In particular, adequate processing orders, various etching procedures and possible drawbacks of the GdScO3 deposition process on ohmic contacts are discussed. Making use of the gained knowledge we fabricated GdScO3-MOSHFETs for the first time. Compared to a conventional HFET the new device shows a higher saturation drain current and a lower gate leakage current. Nevertheless, the potential insulating properties of GdScO3 are not fully exploited yet and further optimization of the deposition process is needed. [less ▲]

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