References of "Bour, Jérôme"
     in
Bookmark and Share    
Full Text
Peer Reviewed
See detailPrediction of Photovoltaic Cu(In,Ga)Se2 p-n Device Performance by forward Bias Electrochemical Analysis of Only the p-Type Cu(In,Ga)Se2 Films
Colombara, Diego UL; Bertram, Tobias UL; Depredurand, Valérie UL et al

in Electrochemical Society Transactions (2015), 66(6), 19-25

This work is an attempt to rate the quality of Mo/Cu(In,Ga)Se2 films intended for fabrication of photovoltaic devices. The procedure is based on the simple current-voltage electrochemical analysis of the ... [more ▼]

This work is an attempt to rate the quality of Mo/Cu(In,Ga)Se2 films intended for fabrication of photovoltaic devices. The procedure is based on the simple current-voltage electrochemical analysis of the bilayer in a Eu2+/3+-containing electrolyte solution. Two series of bilayer samples were tested electrochemically, while sister samples were completed into Mo/Cu(In,Ga)Se2/CdS/i-ZnO/Al:ZnO/Ni-Al solid state devices and their current-voltage characteristics measured in the dark. A correlation was found between the reverse saturation current density of the solid state devices and an analogous parameter extracted from the electrochemical response in forward bias. While Eu2+ was found to be metastable in water posing restrictions to the application, reproducible measurements were achieved with a methanol-based solution. The intrinsic simplicity of the proposed methodology makes it particularly suitable for the implementation of a low-cost diagnostic tool. [less ▲]

Detailed reference viewed: 142 (8 UL)
Full Text
Peer Reviewed
See detailThermal and electrical aging of laser braze-welded aluminum–copper interconnects
Solchenbach, Tobias UL; Plapper, Peter UL; Greger, Manfred UL et al

in Translational Materials Research (2014), 1(1), 015001

Aluminum–copper (Al–Cu) interconnects are of great interest for a variety of electrical applications, such as lithium-ion batteries. In this paper, the effects of thermal and electrical aging on the ... [more ▼]

Aluminum–copper (Al–Cu) interconnects are of great interest for a variety of electrical applications, such as lithium-ion batteries. In this paper, the effects of thermal and electrical aging on the intermetallic compound growth of laser braze-welded Al–Cu interconnects are reported. Thermal aging was studied in a temperature range from 200 to 500 °C for durations between 1 and 120 h. Electrical aging was studied with 200 A direct current application with different polarities and durations between 1 and 24 h. The formation of intermetallic compounds was found to be dependent on the type of aging and, for electrical aging, on the polarity of the current. The growth of intermetallic compounds under the influence of the electric current was distinctly higher than for thermal annealing conditions. The formation of voids at the transition between intermetallic compounds indicates that electromigration may be the main driving force for the accelerated intermetallic growth. [less ▲]

Detailed reference viewed: 132 (15 UL)