References of "Kordos, P"
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See detailUltrafast metal-semiconductor-metal photodetectors on low-temperature-grown GaN
Mikulics, M.; Marso, Michel UL; Javorka, P. et al

in Applied Physics Letters (2005), 86(21), 211110

We have fabricated and characterized ultrafast metal-semiconductor-metal photodetectors based on low-temperature-grown sLTd GaN. The photodetector devices exhibit up to 200 kV/cm electric breakdown fields ... [more ▼]

We have fabricated and characterized ultrafast metal-semiconductor-metal photodetectors based on low-temperature-grown sLTd GaN. The photodetector devices exhibit up to 200 kV/cm electric breakdown fields and subpicosecond carrier lifetime. We recorded as short as 1.4-ps-wide electrical transients using 360-nm-wavelength and 100-fs-duration laser pulses, that is corresponding to the carrier lifetime of 720 fs in our LT GaN material. [less ▲]

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See detailInfluence of carrier supply doping on the RF properties of AlGaN/GaN/SiC high-electron-mobility transistors
Marso, Michel UL; Bernát, J.; Javorka, P. et al

in Physica Status Solidi C. Current Topics in Solid State Physics (2005), 2(7), 2611-2614

We have fabricated undoped as well as modulation-doped AlGaN/GaN HEMTs on SiC substrate. The influence of the carrier supply layer on device performance is investigated by Hall, channel conductivity ... [more ▼]

We have fabricated undoped as well as modulation-doped AlGaN/GaN HEMTs on SiC substrate. The influence of the carrier supply layer on device performance is investigated by Hall, channel conductivity, small signal RF and delay time evaluation. While the doping layer improves the DC performance it degrades the RF behaviour of the device with the highest carrier supply doping of 5x1018 cm–3. The channel conductivity measurements show identical dependence of the mobility on carrier concentration for all samples. The saturation velocity, extracted by evaluation of the total delay time as function of the inverse drain current, decreases from 0.86x107 cm/s for the undoped device to 0.7x107 cm/s for the highest doped HEMT. This result shows that the degradation of RF performance is due to the reduction of the effective saturation velocity caused by the carrier supply layer. [less ▲]

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See detailInfluence of passivation-induced stress on the performance of AlGaN/GaN HEMTs
Gregusova, Dagmar; Bernát, J.; Drzik, M. et al

in Physica Status Solidi C. Current Topics in Solid State Physics (2005), 2(7), 2619-2622

This paper reports on properties of intentionally undoped AlGaN/GaN/sapphire-based high electron mobility transistors (HEMTs) before and after passivation with SiO2 and Si3N4. Our results indicate that ... [more ▼]

This paper reports on properties of intentionally undoped AlGaN/GaN/sapphire-based high electron mobility transistors (HEMTs) before and after passivation with SiO2 and Si3N4. Our results indicate that the DC performance of the AlGaN/GaN HEMTs improved significantly as the stress in the passivation layer increased from compressive to tensile. It corresponded to changes in the sheet carrier concentration. Unlike the DC properties, RF properties of the HEMTs were less sensitive to the stress. [less ▲]

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See detailUltrafast Phenomena in Freestanding LT-GaAs Devices
Marso, Michel UL; Mikulics, M.; Adam, R. et al

in Acta Physica Polonica A (2005), VOL 107; PART 1

We report on the fabrication and high-frequency performance of our photodetectors and photomixers based on freestanding low-temperature-grown GaAs. The MBE-grown low-temperature GaAs layers are lifted ... [more ▼]

We report on the fabrication and high-frequency performance of our photodetectors and photomixers based on freestanding low-temperature-grown GaAs. The MBE-grown low-temperature GaAs layers are lifted from the native GaAs substrate and transferred on top of variety of host substrates. The freestanding devices exhibit breakdown electrical ¯elds above 200 kV/cm and dark currents below 3 £ 10¡7 A at 100 V bias. Device photoresponse shows 0.55 ps wide electrical transients with voltage amplitudes up to 1.3 V, measured using an electro-optical sampling technique with 100 fs wide laser pulses. Photomixing experiments at 460 GHz yield a 9 times higher output power for the freestanding device on Si/SiO2 host substrate compared to the native substrate. [less ▲]

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See detailSiO2 /AlGaN/GaN MOSHFET with 0.7 µm gate-length and fmax / fT of 40/24 GHz
Bernát, J.; Gregusová, D.; Heidelberger, G. et al

in Electronics Letters (2005), 41(11), 667-668

The performance of SiO2/AlGaN/GaN MOSHFETs is described. The C–V measurements showed slight increase in sheet carrier density after applying 12 nm-thick PECVD SiO2. The devices exhibited gate leakage ... [more ▼]

The performance of SiO2/AlGaN/GaN MOSHFETs is described. The C–V measurements showed slight increase in sheet carrier density after applying 12 nm-thick PECVD SiO2. The devices exhibited gate leakage current of 5 .10 ^-10 A/mm. Small-signal RF characterisation of 0.7 mm gate length devices yielded an fT of 24 GHz and an fmax of 40 GHz, which are comparable to those typical for state-of-the-art AlGaN/GaN HFETs. [less ▲]

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See detailLow Current Dispersion and Low Bias-stress Degradation of Unpassivated GaN/AlGaN/GaN/SiC HEMTs
Bernát, J.; Pierobon, R.; Marso, Michel UL et al

in Physica Status Solidi C. Current Topics in Solid State Physics (2005), 2(7), 2676-2679

The performance of unpassivated GaN/AlGaN/GaN/SiC HEMTs with intentionally undoped and doped barrier structures are extensively studied. No drain current dispersion between DC and 50 ns pulses on doped ... [more ▼]

The performance of unpassivated GaN/AlGaN/GaN/SiC HEMTs with intentionally undoped and doped barrier structures are extensively studied. No drain current dispersion between DC and 50 ns pulses on doped devices and less than 10% dispersion on undoped ones is observed. The full (100%) current recovery on undoped sample was measured in 1μs. The drain current extrapolated from 2 GHz large signal measurements corresponds to the measured static drain current confirming negligible current dispersion of our devices. Insignificant (<5 %) degradation in overall device performance parameters (IDs, gm, fT, fmax, Pout) on both undoped and doped structures after 12-hour-long bias stress was obtained. These results documents that suitable device performances can be obtained also on unpassivated GaN-based HEMTs. [less ▲]

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See detailInfluence of doping density on small and large signal characteristics of AlGaN/GaN/SiC HEMTs
Fox, A.; Marso, Michel UL; Bernát, J. et al

in Proc. 5th Intern. Conf. Advanced Semicon. Dev. & Microsystems ASDAM’04 (2004)

The small signal S-parameter and load pull measurements on AlGaN/GaN HEMTs with different doping densities are reported. The cut-off frequencies ft and fmax of 38 and 67 GHz respectively, and the maximal ... [more ▼]

The small signal S-parameter and load pull measurements on AlGaN/GaN HEMTs with different doping densities are reported. The cut-off frequencies ft and fmax of 38 and 67 GHz respectively, and the maximal output powers of 4.9 and 3.8 W/mm at 2 and 7 GHz respectively, were achieved. The parameter extraction from small signal S-parameters shows an increase of gate-source capacitance and transconductance with the doping concentration and hence its influence on small signal (ft and fmax) and power performance. [less ▲]

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See detailMSM varactor diodes based on AlGaN/GaN/SiC HEMT layer structures
Marso, Michel UL; Bernát, J.; Javorka, P. et al

in Proc. 5th Intern. Conf. Advanced Semicon. Dev. & Microsystems ASDAM’04 (2004)

The influence of a carrier supply layer on the electrical properties of MSM diodes based on AlGaN/GaN HEMT layer structures is investigated. The voltage dependence of the Schottky contact capacitance ... [more ▼]

The influence of a carrier supply layer on the electrical properties of MSM diodes based on AlGaN/GaN HEMT layer structures is investigated. The voltage dependence of the Schottky contact capacitance allows the use of the device as varactor diode with CMAX / CMIN ratios up to 17, tuneable by contact geometry. The carrier supply doping determines the sheet carrier density of the twodimensional electron gas channel, which is responsible for the transition voltage and the series resistance of the MSM diode. A device based on the highest doped layer structure shows a cutoff frequency as high as 65 GHz. [less ▲]

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See detailA novel two-color photodetector based on an InAlAs-InGaAs HEMT layer structure
Marso, Michel UL; Wolter, M.; Kordoš, P.

in IEEE Photonics Technology Letters (2004), 16 (2004)(11), 2541-2543

The spectral responsivity of an InAlAs–InGaAs metal–semiconductor–metal diode above a two-dimensional electron gas (2DEG) is investigated as a function of the applied bias. At low voltages, only the ... [more ▼]

The spectral responsivity of an InAlAs–InGaAs metal–semiconductor–metal diode above a two-dimensional electron gas (2DEG) is investigated as a function of the applied bias. At low voltages, only the InAlAs layer above the 2DEG contributes to the photocurrent, while the InGaAs channel layer is activated at higher bias. This results in a voltage-dependent spectral response of the photodetector. The ratio of the responsivities at 1300 and 850 nm changes from 0.03- at 1-V to 0.44- at 1.6-V bias. This property makes the device a candidate suitable to detect and to separate optical information originated both from the GaAs (850 nm) and in the InGaAs (1300, 1550 nm)-based optoelectronic technology. [less ▲]

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See detailImpact of layer structure on performance of unpassivated AlGaN/GaN/SiC HEMTs,
Bernát, J.; Wolter, M.; Fox, A. et al

in Electronics Letters (2004), 40(1), 78-80

The performance of unpassivated AlGaN=GaN=SiC HEMTs prepared on different MOVPE grown layer structures is reported. An overall improvement of device characteristics using doped structures in comparison to ... [more ▼]

The performance of unpassivated AlGaN=GaN=SiC HEMTs prepared on different MOVPE grown layer structures is reported. An overall improvement of device characteristics using doped structures in comparison to undoped counterpart is observed. This can be demonstrated by IDS of 0.86 and 1.33 A=mm, gm of 220 and 273 mS=mm, fT of 33 and 43 GHz and fmax of 54 and 61 GHz for 0.3 mm gate length devices on undoped and doped structures, respectively. The DC=pulsed I–V characteristics as well as power measurements show insignificant RF dispersion of HEMTs on doped structures. These results underline the advantage of doped layer structures for preparation of high-performance AlGaN=GaN HEMTs. [less ▲]

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See detailVertical Double-Gate MOSFETs
Moers, J.; Trellenkamp, St; Marso, Michel UL et al

in Proc. 5th Intern. Conf. Advanced Semicon. Dev. & Microsystems ASDAM’04 (2004)

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See detailInfluence of a carrier supply layer on carrier density and drift mobility of AlGaN/GaN/SiC high-electron-mobility transistors
Marso, Michel UL; Bernát, J.; Javorka, P. et al

in Applied Physics Letters (2004), 84 (2004)

Sheet carrier concentration and low-field drift mobility of intentionally undoped and modulation-doped AlGaN/GaN heterostructures on SiC substrate were evaluated by capacitance-voltage and channel ... [more ▼]

Sheet carrier concentration and low-field drift mobility of intentionally undoped and modulation-doped AlGaN/GaN heterostructures on SiC substrate were evaluated by capacitance-voltage and channel conductivity measurements. Sheet carrier concentration and average mobility at 0 V gate bias correspond to standard Hall results. Sheet carrier density increases from 6.831012 cm22 for the undoped sample up to 131013 cm22 for the device with the highest doping concentration, while the mobility decreases from 1800 to 1620 cm2/V s. The local mobility, on the other hand, depends only on the actual sheet carrier density and is not influenced by the doping concentration of the carrier supply layer. It reaches a maximum value of 2100 cm2/Vs at a carrier density of 331012 cm22. [less ▲]

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See detailAn optimization of terahertz local oscillators based on LT-GaAs technology
Mayorga, I. C.; Mikulics, M.; Schmitz, A. et al

in SPIE (2004), 5498 (2004)

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See detailNitrogen implanted GaAs for ultrafast photodetectors and photomixers
Mikulics, M.; Wolter, M. J.; Marso, Michel UL et al

in Proc. 5th Intern. Conf. Advanced Semicon. Dev. & Microsystems ASDAM’04 (2004)

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See detailInfluence of layer structure on performance of AlGaN/GaN High Electron Mobility Transistors before and after passivation
Bernát, J.; Javorka, P.; Fox, A. et al

in Journal of Electronic Materials (2004), 33((2004)), 436-439

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See detailDC and Pulsed Behaviour of Undoped and Doped AlGaN/GaN/SiC HEMTs before and after Si3N4 passivation
Bernát, J.; Marso, Michel UL; Fox, A. et al

in Proc. 5th Intern. Conf. Advanced Semicon. Dev. & Microsystems ASDAM’04 (2004)

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See detailLarge-area traveling-wave LT-GaAs photomixers for LO application
Michael, E. A.; Mikulics, M.; Marso, Michel UL et al

in SPIE (2004), 5498 (2004)

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See detailPerformance of unpassivated AlGaN/GaN/SiC HEMTs after short-term electrical bias stress
Bernát, J.; Wolter, M.; Javorka, P. et al

in Solid-State Electronics (2004), 48((2004)), 1825-1828

Performance of unpassivated MOVPE grown AlGaN/GaN/SiC HEMTs under short-term electrical bias stress isreported. Insignificant degradation in DC and RF behaviour of prepared devices after 16 h stress at VD ... [more ▼]

Performance of unpassivated MOVPE grown AlGaN/GaN/SiC HEMTs under short-term electrical bias stress isreported. Insignificant degradation in DC and RF behaviour of prepared devices after 16 h stress at VD ¼ 21 V and VG ¼ 2:5 V is observed. This can be demonstrated by a maximum drain current of 1.03 and 1.01 A/mm and a peak extrinsic transconductance of 233 and 225 mS/mm before and after bias stress, respectively. Consecutive drain voltage sweeps indicates on low current collapse in samples investigated. The RF characteristics show a decrease of the fmax-tof T ratio from 2.23 to 2.15 and the saturated output power density measured at 2 GHz from 3.60 to 3.53 W/mm after the devices were stressed. This result indicates that reliable AlGaN/GaN/SiC HEMTs without passivation can be prepared. However, additional studies are needed to understand if the material structure and/or the device processing is responsible for low current collapse and RF dispersion in these devices. [less ▲]

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See detailFabrication and performance of hybrid photoconductive devices based on freestanding LT-GaAs, Ultrafast Phenomena in Semiconductors and Nanostructure Materials VIII,
Adam, R.; Mikulics, M.; Wu, S. et al

in Proceedings of SPIE (2004), 5353 (2004)

We report on fabrication and high-frequency performance of our photodetectors and photomixers based on freestanding low-temperature-grown GaAs (LT-GaAs). In our experiments, the LT-GaAs/AlAs bilayers were ... [more ▼]

We report on fabrication and high-frequency performance of our photodetectors and photomixers based on freestanding low-temperature-grown GaAs (LT-GaAs). In our experiments, the LT-GaAs/AlAs bilayers were grown on 2-inch diameter, semi-insulating GaAs wafers by a molecular beam epitaxy. Next, the bilayer was patterned to form 10 × 10 μm2 to 150 × 150 μm2 structures using photolithography and ion beam etching. The AlAs layer was then selectively etched in diluted HF solution, and the LT-GaAs device was lifted from its substrate and transferred on top of a variety of substrates including Si, MgO/YBaCuO, Al2O3, and a plastic foil. Following the transfer, metallic coplanar transmission lines were fabricated on top of the LT-GaAs structure, forming a metal semiconductor-metal photodetectors or photomixer structures. Our freestanding devices exhibited above 200 V breakdown voltages and dark currents at 100 V below 3×10-7 A. Device photoresponse was measured using an electro-optic sampling technique with 100-fs-wide laser pulses at wavelengths of 810 nm and 405 nm as the excitation source. For 810-nm excitation, we measured 0.55 ps-wide electrical transients with voltage amplitudes of up to 1.3 V. The signal amplitude was a linear function of the applied voltage bias, as well as a linear function of the laser excitation power, below well-defined saturation thresholds. Output power from the freestanding photomixers was measured with two beam laser illumination experimental setup. Reported fabrication technique is suitable for the LT-GaAs integration with a range of semiconducting, superconducting, and organic materials for high-frequency hybrid optoelectronic applications. [less ▲]

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See detailGeneration of 1 THz radiation by photomixing in low-temperature-grown MBE GaAs
Mikulics, M.; Camara, I.; Marso, Michel UL et al

in Proc. 5th Intern. Conf. Advanced Semicon. Dev. & Microsystems ASDAM’04 (2004)

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