References of "Kordoš, P"
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See detailVertical p-MOSFETs with gate oxide deposition before selective epitaxial growth
Moers, J.; Klaes, D.; Tönnesmann, A. et al

in Solid-State Electronics (1999), 43(1999), 529-535

A novel vertical MOSFET concept using selective epitaxial growth by low pressure chemical vapor deposition is proposed and the ®rst p-channel device characteristics measured are described. In contrast to ... [more ▼]

A novel vertical MOSFET concept using selective epitaxial growth by low pressure chemical vapor deposition is proposed and the ®rst p-channel device characteristics measured are described. In contrast to other MOS technologies, the gate oxide is deposited before epitaxy, and therefore it exists before the channel region is grown. Compared to planar layouts, the vertical layout increases the packing density without the use of advanced lithography; the extent of the increase depends on application. Compared to other vertical transistors, this concept reduces overlap capacitance and o ers the possibility of three-dimensional integration. Vertical p channel MOSFETs with a channel length LG down to 130 nm and a gate oxide thickness dox down to 12 nm have been fabricated and yield a transconductance of 100 mS mm-1. [less ▲]

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See detail19 GHz vertical Si p-channel MOSFET
Moers, J.; Klaes, D.; Tönnesmann, A. et al

in Electronics Letters (1999), 35(1999), 239-240

Vertical Si p-MOSFETs with channel lengths of 100nm were fabricated using selective low pressure chemical vapour deposition (LPCVD) epitaxial growth and conventional i-line lithography. The layout, called ... [more ▼]

Vertical Si p-MOSFETs with channel lengths of 100nm were fabricated using selective low pressure chemical vapour deposition (LPCVD) epitaxial growth and conventional i-line lithography. The layout, called VOXFET, reduces gate to source/drain overlap capacitances, thus improving high speed applications. Transistors with a gate width of 12 um and gate oxide thickness of 10nm show transconductances gM of 200mS/mm and measured cutoff frequencies of fT = 8.7GHz and fMAX = 19.2 GHz. [less ▲]

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See detailCoupling of insect antennae to field-effect transistors for biochemical sensing
Schroth, P.; Schöning, M. J.; Schütz, S. et al

in Electrochimica Acta (1999), 44(1999), 3821-3826

A bioelectronic interface based on the coupling of an intact insect antenna to a field-e effct transistor (FET) has been realised in a whole-beetle BioFET (Biologically sensitive FET) and an isolated ... [more ▼]

A bioelectronic interface based on the coupling of an intact insect antenna to a field-e effct transistor (FET) has been realised in a whole-beetle BioFET (Biologically sensitive FET) and an isolated-antenna BioFET configuration. The intrinsic BioFET characteristics, such as current-voltage curves, transconductance and signal-to-noise ratio clearly depend on the chip layout. Therefore, the experiments were performed with three di erent gate geometries: linear shape (5 um x 100 um), U shape (5 um x 1000 um) and meander shape (10 um x 6000 um). The BioFET allows the determination of the `green-leaf odour' Z-3-hexen-l-ol down to the low ppb concentration range. Thus, the detection of plant damages is possible with this novel kind of biosensor. [less ▲]

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See detailAn InAlAs-InGaAs OPFET with Responsivity Above 200 A/W at 1.3 µm Wavelength
Marso, Michel UL; Gersdorf, P.; Fox, A. et al

in IEEE Photonics Technology Letters (1999), 11

The optoelectronic dc and RF behavior of an InAlAs–InGaAs optically controlled field-effect transistor based on a high electron mobility transistor layer structure is investigated at 1.3- um wavelength ... [more ▼]

The optoelectronic dc and RF behavior of an InAlAs–InGaAs optically controlled field-effect transistor based on a high electron mobility transistor layer structure is investigated at 1.3- um wavelength light. The device is backside-illuminated to increase the responsivity. A transistor with 0.3-u m gate length and an active area of 50 x 50 u m2 exhibits a responsivity of 235 A/W, at 11- W incident optical power. The photoconductive response is higher than for an metal–semiconductor–metal photodetector with the same InGaAs absorption layer thickness up to 10 GHz. [less ▲]

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See detail550 GHz bandwidth photodetector on low-temperature grown molecular-beam epitaxial GaAs
Kordoš, P.; Förster, A.; Marso, Michel UL et al

in Electronics Letters (1998), 34(1998), 119-120

The authors demonstrate that a 550GHz bandwidth photodetector can be fabricated on low-temperature grown MBE GaAs. The pulse response shows 0.4 and 0.6ps rise and fall times, respectively. The bandwidth ... [more ▼]

The authors demonstrate that a 550GHz bandwidth photodetector can be fabricated on low-temperature grown MBE GaAs. The pulse response shows 0.4 and 0.6ps rise and fall times, respectively. The bandwidth is in agreement with a value calculated using a carrier lifetime of 0.2ps, measured by femtosecond time-resolved reflectivity, and a capacitance of 0.014fF/um2, determined from microwave measurements. The device bandwidth is RC limited. [less ▲]

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See detailOptoelectronic D.C. and R.F. behavior of InP/InGaAs Based HEMTs
Marso, Michel UL; Horstmann, M.; Hardtdegen, H. et al

in Solid-State Electronics (1998), 42(1998), 197-200

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See detailMicrowave Properties of the MSM Photodetectors with 2-DEG
Tomáška, M.; Marso, Michel UL; Fox, A. et al

in Proc. 2nd International Conference on Advanced Semiconductor Devices and Microsystems (1998)

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See detailConduction in nonstoichiometric molecular-beam epitaxial GaAs grown above the critical thickness
Kordoš, P.; Marso, Michel UL; Luysberg, M.

in Applied Physics Letters (1998), 72

Different conduction behavior is observed in nonstoichiometric ~NS! molecular-beam epitaxial GaAs grown at 200 °C below and above the critical thickness. In the low-field Ohmic region only the ... [more ▼]

Different conduction behavior is observed in nonstoichiometric ~NS! molecular-beam epitaxial GaAs grown at 200 °C below and above the critical thickness. In the low-field Ohmic region only the monocrystalline part of the layer contributes to the room-temperature resistivity, but at higher temperatures the resistivity scales with the total layer thickness. In NS GaAs grown above the critical thickness, a superlinear J –V^n (n=2 – 3) dependence is found at intermediate fields. The prebreakdown voltage is proportional to the total thickness. This indicates that different defects control the electrical properties of the polycrystalline and monocrystalline parts of the NS GaAs. These results can be useful in the design of NS GaAs based devices, which operate at higher temperature and/or higher electric fields. [less ▲]

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See detailInvestigations on InAlAs/InGaAs OPFETs with different absorption layer thicknesses
Marso, Michel UL; Gersdorf, P.; Fox, A. et al

in Proceedings of the 6th International Workshop on High Performance Electron Devices for Microwave and Optoelectronic Applications (EDMO) (1998)

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See detailPIN-PJBT Integration: A New GaAs Based Optoelectronic Receiver,
Dillmann, F.; Marso, Michel UL; Hardtdegen, H. et al

in Proceedings of the 28th European Solid State Devices Research Conference, Bordeaux, France, (1998)

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See detailSelectively Grown Vertical Si p-MOS Transistor with Reduced Overlap Capacitances
Klaes, D.; Moers, J.; Tönnesmann, A. et al

in Proceedings of the 28th European Solid State Devices Research Conference, Bordeaux, France (1998)

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See detailThe electrical behaviour of GaAs MESFETs formed on high and low temperature GaAs buffer layers
Borouriand, Farahd; Jostock, Markus UL; Hopkinson, M et al

in High Performance Electron Devices for Microwave and Optoelectronic Applications (1997, November 24)

Comparisons have been made between the channel currents in GaAs hESFETs prepared on GaAs buffer layers prepared at normal and low temperatures. All devices made on LT buffer layers had saturated channel ... [more ▼]

Comparisons have been made between the channel currents in GaAs hESFETs prepared on GaAs buffer layers prepared at normal and low temperatures. All devices made on LT buffer layers had saturated channel currents which were about 20% of similar devices on a normal buffer. An attempt was made to remove Ga vacanciies from the LT buffer by a high temperature anneal step before the epitaxial layer was prepared. This had no effect in increasing the channel current. In all cases the pinchoiy voltage was unchanged indicating constancy of the channel thickness and donor concentration. It is concluded that the loss of current is due to a loss of mobile charge through trapping. [less ▲]

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See detailMSM Photodetectors Based on InP/InGaAs 2DEG Structures, in Optoelectronic Properties of Semiconductors and Superlattices
Horstmann, M.; Marso, Michel UL; Kordoš, P.

Book published by Gordon and Brerach Science Publishers (1997)

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See detailElectrical Behaviour of the InP/InGaAs Based MSM-2DEG Diode
Marso, Michel UL; Horstmann, M.; Hardtdegen, H. et al

in Solid-State Electronics (1997), 41(1997), 25-31

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See detailSpace-charge controlled conduction in low-temperature-grown molecular-beam epitaxial GaAs,
Kordoš, P.; Marso, Michel UL; Förster, A. et al

in Applied Physics Letters (1997), 71

Current transport in low-temperature (LT) molecular-beam epitaxial GaAs grown at 200-300 °C on an n+ GaAs substrate is studied by means of current–voltage–temperature characteristics. The resistivity of ... [more ▼]

Current transport in low-temperature (LT) molecular-beam epitaxial GaAs grown at 200-300 °C on an n+ GaAs substrate is studied by means of current–voltage–temperature characteristics. The resistivity of LT GaAs at low electric fields is rho>108 Ohm cm, much higher than resulting from van der Pauw measurements. It is found that the measured resistivity decreases with increasing the LT GaAs thickness. This is explained by space-charge effect in the vicinity of n+/LT GaAs junction and subsequent suppression of hopping conduction in the high-field junction region. [less ▲]

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See detailDemonstration of Nitrogen Carrier Gas in MOVPE For InP/InGaAs-Based High Frequency and Optoelectronic Integrated Devices
Hardtdegen, H.; Marso, Michel UL; Horstmann, M. et al

in Proceedings of the 9th International Conference on InP and Related Materials, Hyannis, Massachusetts, USA (1997)

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See detailHigh Bandwidth InP/InGaAs Based MSM-2DEG Diodes For Optoelectronic Application,
Marso, Michel UL; Horstmann, M.; Schimpf, K. et al

in Proceedings of the 9th International Conference on InP and Related Materials (1997)

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See detailOptoelectronic DC and RF behaviour of InAlAs/InGaAs based HEMTs at 1.3µm wavelength
Marso, Michel UL; Fox, A.; Förster, A. et al

in Proc. 3rd Asia-Pacific Conference on Communications, Sydney, Australia (1997)

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See detail0.1 µm T-gate Al-free InP/InGaAs/InP pHEMTs for W-Band Applications Using a Nitrogen Carrier for LP-MOCVD Growth
Schimpf, K.; Sommer, M.; Horstmann, M. et al

in IEEE Electron Device Letters (1997), 18

We report on the dc and RF performance of HEMT’s based on the Al-free material system InP/InGaAs/InP. These structures were grown by LP-MOCVD using a nitrogen carrier. The influence of gate length and ... [more ▼]

We report on the dc and RF performance of HEMT’s based on the Al-free material system InP/InGaAs/InP. These structures were grown by LP-MOCVD using a nitrogen carrier. The influence of gate length and channel composition on the performance of these devices is investigated.We demonstrate that optimum dc and RF performance using highly strained channels can be obtained only if additional composite channels are grown. The cutoff frequencies fT =160 GHz and fmax=260 GHz for a 0.1- um T-gate device indicate the suitability of our devices for W-Band applications. [less ▲]

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See detailInP-Based Monolithically Integrated Photoreceiver for 4-10Gbit/s Optoelectronic Systems
Horstmann, M.; Hardtdegen, H.; Schimpf, K. et al

in Proceedings of the Gallium Arsenide Application Symposium GAAS 96, Paris, France (1996)

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