References of "Fox, Alfred"
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See detailReduction of skin effect losses in double-level-T-gate structure
Mikulics, Martin; Hardtdegen, Hilde; Arango, Y. C. et al

in Applied Physics Letters (2014), 105

We developed a T-gate technology based on selective wet etching yielding 200 nm wide T-gate structures used for fabrication of High Electron Mobility Transistors (HEMT). Major advantages of our process ... [more ▼]

We developed a T-gate technology based on selective wet etching yielding 200 nm wide T-gate structures used for fabrication of High Electron Mobility Transistors (HEMT). Major advantages of our process are the use of only standard photolithographic process and the ability to generate T-gate stacks. A HEMT fabricated on AlGaN/GaN/sapphire with gate length Lg=200 nm and double-stacked T-gates exhibits 60 GHz cutoff frequency showing ten-fold improvement compared to 6 GHz for the same device with 2 um gate length. HEMTs with a double-level-T-gate (DLTG) structure exhibit up to 35% improvement of fmax value compared to a single T-gate device. This indicates a significant reduction of skin effect losses in DLTG structure compared to its standard T-gate counterpart. These results agree with the theoretical predictions. [less ▲]

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See detailNovel Double-Level-T-Gate Technology
Fox, Alfred; Mikulics, Martin; Hardtdegen, Hilde et al

in Conference Proceedings The 10th International Conference on Advanced Semiconductor devices and Microsystems (2014, October)

We developed a novel double-level-T-gate technology based on wet etching of a metal gate interlayer. With the help of this technological process we prepared T-gate feet with widths as small as 200 nm. The ... [more ▼]

We developed a novel double-level-T-gate technology based on wet etching of a metal gate interlayer. With the help of this technological process we prepared T-gate feet with widths as small as 200 nm. The major advantage of our process is its use of only standard optical lithography. It allows the fabrication of 100 nanometer size T-gates for transistors. High electron mobility transistors (HEMTs) were fabricated on an AlGaN/GaN/sapphire material structure with an original gate length Lg of 2 μm. Their cutoff frequency of 6 GHz was improved to 60 GHz by etching the gate to a 200 nm length double T-gate contact. [less ▲]

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See detailTowards future III-nitride based THz OEICs in the UV range
Fox, Alfred; Mikulics, Martin; Winden, Andreas et al

in ASDAM 2012, The Ninth International Conference on Advanced Semiconductor Devices and Microsystems (2012)

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See detailResidual strain in recessed AlGaN/GaN heterostructure field-effect transistors evaluated by micro photoluminescence measurements
Mikulics, Martin; Hardtdegen, Hilde; Winden, Andreas et al

in Physica Status Solidi C. Current Topics in Solid State Physics (2012), 9(3-4), 911-914

The residual strain in AlGaN/GaN heterostructure field-effect transistors (HFETs) with recessed gates and their non-recessed counterparts were investigated by micro photoluminescence measurements (μ-PL ... [more ▼]

The residual strain in AlGaN/GaN heterostructure field-effect transistors (HFETs) with recessed gates and their non-recessed counterparts were investigated by micro photoluminescence measurements (μ-PL). It is found that strain relaxation accounts for the observed sheet carrier density reduction after gate recessing. The usefulness of the method for device processing optimization is demonstrated. © 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. [less ▲]

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See detailElectrical and structural characterization of AlGaN/GaN field-effect transistors with recessed gate
Mikulics, Martin; Fox, Alfred; Marso, Michel UL et al

in Vacuum (2012), 86(6), 754-756

Performance of AlGaN/GaN heterostructure field-effect transistors (HFETs) with recessed gate was investigated and compared with non-recessed counterparts. Optimal dry etch conditions by plasma assisted Ar ... [more ▼]

Performance of AlGaN/GaN heterostructure field-effect transistors (HFETs) with recessed gate was investigated and compared with non-recessed counterparts. Optimal dry etch conditions by plasma assisted Ar sputtering were found for ~6 nm gate recess of a 20 nm thick AlGaN barrier layer. A decrease of the residual strain after the gate recessing (from -0.9 GPa to -0.68 GPa) was evaluated from the photoluminescence measurement. The saturation drain current at the gate voltage VG = 1 V decreased from 1.05 A/mm to 0.85 A/mm after the recessing. The gate voltage for a maximal transconductance (240-250 mS/mm) has shifted from -3 V for non-recessed HFETs to -0.2 V for recessed counterparts. Similarly, the threshold voltage increased after the gate recessing. A decrease of the sheet charge density from 1 x 10 13 cm-2 to4 x 10 12 cm-2 at VG = 0 V has been evaluated from the capacitance measurements. The RF measurements yielded a slight increase of the cut-off frequencies after the gate recessing. All these indicate that the gate recessing is a useful tool to optimize the AlGaN/GaN HFET performance for high-frequency applications as well as for the preparation of normally-off devices. [less ▲]

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See detailComparison of AlGaN/GaN HFETs and MOSHFETs in prospect of oscillator design
Fox, Alfred; Mikulics, Martin; Strang, B. et al

in The Eighth International Conference on Advanced Semiconductor Devices and Microsystems, ASDAM 2010 (2010)

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See detailOrigin of Improved RF Performance of AlGaN/GaN MOSHFETs Compared to HFETs,
Marso, Michel UL; Heidelberger, Gero; Indlekofer, Klaus Michael et al

in IEEE Transactions on Electron Devices (2006), 53(7), 1517-1723

In this paper, the influence of a 10-nm-thick silicondioxide layer, as a passivation or as a gate insulation, on the performance of heterojunction field-effect transistors (HFETs) and ... [more ▼]

In this paper, the influence of a 10-nm-thick silicondioxide layer, as a passivation or as a gate insulation, on the performance of heterojunction field-effect transistors (HFETs) and metal–oxide–semiconductor HFETs (MOSHFETs), based on an undoped AlGaN/GaN heterostructure on a SiC substrate, was investigated. Channel-conductivity results yield a nearly 50% increase of mobility in the MOSHFET samples compared to the unpassivated HFETs. This increase of the transport properties of the MOSHFET channel is confirmed by a similar 45% increase of the cutoff frequency, from 16.5 to 24 GHz. Hall measurements, however, show a 10% decrease of the mobility in the heterostructure with a SiO2 top layer. In this paper, the superior performance of the MOSHFET transistor, in contradiction to the Hall results, is attributed to the screening of the Coulomb scattering of the charged surface defects by the gate-metallization layer. [less ▲]

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