Reference : Influence of the microstructure on the stress state of solder joints dusing thermal c...
Scientific congresses, symposiums and conference proceedings : Paper published in a journal
Engineering, computing & technology : Multidisciplinary, general & others
Computational Sciences
http://hdl.handle.net/10993/34897
Influence of the microstructure on the stress state of solder joints dusing thermal cycling
English
Menk, A. [Robert Bosch GmbH, P.O. Box 30 02 40, 70442 Stuttgart, Germany]
Bordas, Stéphane mailto [University of Luxembourg > Faculty of Science, Technology and Communication (FSTC) > Engineering Research Unit >]
2009
Proceedings of 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
Yes
International
Proceedings of 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
26 April 2009 through 29 April 2009
Delft
[en] Anisotropic microstructures ; Creep behaviour ; Damage process ; Grain size ; Numerical experiments ; Solder joints ; Stress state ; Thermomechanical mismatches ; Anisotropy ; Creep ; Experiments ; Microelectronics ; Microstructure ; Microsystems ; Tin ; Welding ; Brazing
[en] The lifetime of a solder joint is mainly determined by its creep behaviour. Creep arises from the stresses inside the solder joints as a consequence of the thermomechanical mismatch of the board and the substrate. The stress state is heavily influenced by the anisotropy of tin. To understand the damage process in solder joints, the influence of the anisotropic microstructure must be understood. In this paper the influence of different grain sizes, shapes and orientations on the stress state is evaluated, based on numerical experiments.
Robert Bosch GmbH
Researchers ; Professionals ; Students ; General public ; Others
http://hdl.handle.net/10993/34897
10.1109/ESIME.2009.4938405

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