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See detailCrack growth analysis by a NURBS-based isogeometric boundary element metyhod
Peng, Xuan; Atroshchenko, Elena; Simpson, Robert et al

Presentation (2014, July)

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See detailCrack growth analysis by a NURBS-based isogeometric boundary element method
Peng, Xuan; Atroshchenko, Elena; Simpson, Robert et al

Scientific Conference (2014, July)

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See detailSensitivity analysis and shape optimization using isogeomgetric boundary element methods
Lian, Haojie; Simpson, Robert; Bordas, Stéphane UL

Scientific Conference (2014, July)

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See detailA Two-Dimensional Isogeometric Boundary Element Method For Linear Elastic Fracture
Peng, Xuan; AtroShchenko, Elena; Simpson, Robert et al

Scientific Conference (2014, January)

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See detailStress analysis without meshing: isogeometric boundary element method
Lian, Haojie; Simpson, Robert; Bordas, Stéphane UL

in Proceedings of the ICE - Engineering and Computational Mechanics (2013), 166(2), 8899

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See detailSensitivity Analysis and Shape Optimisation through a T-spline Isogeometric Boundary Element Method
Lian, Haojie; Simpson, Robert; Bordas, Stéphane UL

Scientific Conference (2013, March 25)

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See detailAn isogeometric boundary element method for elastostatic analysis: 2D implementation aspects
Simpson, Robert; Bordas, Stéphane UL; Lian, Haojie et al

in Computers & Structures (2013), 118

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See detailSensitivity Analysis and Shape Optimisation through a T-spline Isogeometric Boundary Element Method
Lian, Haojie; Simpson, Robert; Bordas, Stéphane UL

Scientific Conference (2013, March)

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See detailSensitivity analysis and shape optimisation with the isogeometric boundary element methods
Lian, Haojie; Simpson, Robert; Bordas, Stéphane UL

Scientific Conference (2012, March 27)

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See detailLifetime prediction for solder joints with the extended finite element method
Menk, Alexander; Pearce, Chris J.; Lanier, Olivier et al

in Proceedings of 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 (2011)

Predicting the lifetime of solder joints undergoing thermal cycling is crucial for the electronics industry in order to guarantee a certain performance of their products in the field. Semi-empirical ... [more ▼]

Predicting the lifetime of solder joints undergoing thermal cycling is crucial for the electronics industry in order to guarantee a certain performance of their products in the field. Semi-empirical methods are often used to predict the average lifetime of the critical joints. However, to get a reliable failure probability the standard deviation must also be addressed. The deviation of the lifetime from the mean value is a consequence of the variation in microstructure found in actual joints. We therefore propose a new methodology that calculates crack growth based on microstructural features of the joint. A series of random microstructures is generated. Crack growth calculations are performed for each of these structures. The structural problem is solved numerically with the extended finite element method which allows a complete automation of the process. The mean crack length and standard deviation are calculated from the crack growth simulations and the result is compared to experimental data. [less ▲]

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