References of "Menk, Alexander"
     in
Bookmark and Share    
Full Text
Peer Reviewed
See detailLifetime prediction for solder joints with the extended finite element method
Menk, Alexander; Pearce, Chris J.; Lanier, Olivier et al

in Proceedings of 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 (2011)

Predicting the lifetime of solder joints undergoing thermal cycling is crucial for the electronics industry in order to guarantee a certain performance of their products in the field. Semi-empirical ... [more ▼]

Predicting the lifetime of solder joints undergoing thermal cycling is crucial for the electronics industry in order to guarantee a certain performance of their products in the field. Semi-empirical methods are often used to predict the average lifetime of the critical joints. However, to get a reliable failure probability the standard deviation must also be addressed. The deviation of the lifetime from the mean value is a consequence of the variation in microstructure found in actual joints. We therefore propose a new methodology that calculates crack growth based on microstructural features of the joint. A series of random microstructures is generated. Crack growth calculations are performed for each of these structures. The structural problem is solved numerically with the extended finite element method which allows a complete automation of the process. The mean crack length and standard deviation are calculated from the crack growth simulations and the result is compared to experimental data. [less ▲]

Detailed reference viewed: 24 (1 UL)
Full Text
Peer Reviewed
See detailCrack growth calculations in solder joints based on microstructural phenomena with X-FEM
Menk, Alexander; Bordas, Stéphane UL

in Computational Materials Science (2011), 50(3), 1145-1156

Determining the lifetime of solder joints subjected to thermomechanical loads is crucial to guarantee the quality of electronic devices. The fatigue process is heavily dependent on the microstructure of ... [more ▼]

Determining the lifetime of solder joints subjected to thermomechanical loads is crucial to guarantee the quality of electronic devices. The fatigue process is heavily dependent on the microstructure of the joints. We present a new methodology to determine the lifetime of the joints based on microstructural phenomena. Random microstructures are generated to capture the statistical variety of possible microstructures and crack growth calculations are performed. The extended finite element method is used to solve the structural problem numerically which allows a complete automation of the process. Numerical examples are given and compared to experimental data. [less ▲]

Detailed reference viewed: 34 (0 UL)
Full Text
Peer Reviewed
See detailNumerically determined enrichment functions for the extended finite element method and applications to bi-material anisotropic fracture and polycrystals
Menk, Alexander; Bordas, Stéphane UL

in International Journal for Numerical Methods in Engineering (2010), 83(7), 805-828

Strain singularities appear in many linear elasticity problems. A very fine mesh has to be used in the vicinity of the singularity in order to obtain acceptable numerical solutions with the finite element ... [more ▼]

Strain singularities appear in many linear elasticity problems. A very fine mesh has to be used in the vicinity of the singularity in order to obtain acceptable numerical solutions with the finite element method (FEM). Special enrichment functions describing this singular behavior can be used in the extended finite element method (X-FEM) to circumvent this problem. These functions have to be known in advance, but their analytical form is unknown in many cases. Li et al. described a method to calculate singular strain fields at the tip of a notch numerically. A slight modification of this approach makes it possible to calculate singular fields also in the interior of the structural domain. We will show in numerical experiments that convergence rates can be significantly enhanced by using these approximations in the X-FEM. The convergence rates have been compared with the ones obtained by the FEM. This was done for a series of problems including a polycrystalline structure. [less ▲]

Detailed reference viewed: 26 (0 UL)