References of "Javorka, P"
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See detailUltrafast metal-semiconductor-metal photodetectors on low-temperature-grown GaN
Mikulics, M.; Marso, Michel UL; Javorka, P. et al

in Applied Physics Letters (2005), 86(21), 211110

We have fabricated and characterized ultrafast metal-semiconductor-metal photodetectors based on low-temperature-grown sLTd GaN. The photodetector devices exhibit up to 200 kV/cm electric breakdown fields ... [more ▼]

We have fabricated and characterized ultrafast metal-semiconductor-metal photodetectors based on low-temperature-grown sLTd GaN. The photodetector devices exhibit up to 200 kV/cm electric breakdown fields and subpicosecond carrier lifetime. We recorded as short as 1.4-ps-wide electrical transients using 360-nm-wavelength and 100-fs-duration laser pulses, that is corresponding to the carrier lifetime of 720 fs in our LT GaN material. [less ▲]

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See detailInfluence of carrier supply doping on the RF properties of AlGaN/GaN/SiC high-electron-mobility transistors
Marso, Michel UL; Bernát, J.; Javorka, P. et al

in Physica Status Solidi C. Current Topics in Solid State Physics (2005), 2(7), 2611-2614

We have fabricated undoped as well as modulation-doped AlGaN/GaN HEMTs on SiC substrate. The influence of the carrier supply layer on device performance is investigated by Hall, channel conductivity ... [more ▼]

We have fabricated undoped as well as modulation-doped AlGaN/GaN HEMTs on SiC substrate. The influence of the carrier supply layer on device performance is investigated by Hall, channel conductivity, small signal RF and delay time evaluation. While the doping layer improves the DC performance it degrades the RF behaviour of the device with the highest carrier supply doping of 5x1018 cm–3. The channel conductivity measurements show identical dependence of the mobility on carrier concentration for all samples. The saturation velocity, extracted by evaluation of the total delay time as function of the inverse drain current, decreases from 0.86x107 cm/s for the undoped device to 0.7x107 cm/s for the highest doped HEMT. This result shows that the degradation of RF performance is due to the reduction of the effective saturation velocity caused by the carrier supply layer. [less ▲]

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See detailPerformance of unpassivated AlGaN/GaN/SiC HEMTs after short-term electrical bias stress
Bernát, J.; Wolter, M.; Javorka, P. et al

in Solid-State Electronics (2004), 48((2004)), 1825-1828

Performance of unpassivated MOVPE grown AlGaN/GaN/SiC HEMTs under short-term electrical bias stress isreported. Insignificant degradation in DC and RF behaviour of prepared devices after 16 h stress at VD ... [more ▼]

Performance of unpassivated MOVPE grown AlGaN/GaN/SiC HEMTs under short-term electrical bias stress isreported. Insignificant degradation in DC and RF behaviour of prepared devices after 16 h stress at VD ¼ 21 V and VG ¼ 2:5 V is observed. This can be demonstrated by a maximum drain current of 1.03 and 1.01 A/mm and a peak extrinsic transconductance of 233 and 225 mS/mm before and after bias stress, respectively. Consecutive drain voltage sweeps indicates on low current collapse in samples investigated. The RF characteristics show a decrease of the fmax-tof T ratio from 2.23 to 2.15 and the saturated output power density measured at 2 GHz from 3.60 to 3.53 W/mm after the devices were stressed. This result indicates that reliable AlGaN/GaN/SiC HEMTs without passivation can be prepared. However, additional studies are needed to understand if the material structure and/or the device processing is responsible for low current collapse and RF dispersion in these devices. [less ▲]

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See detailInfluence of a carrier supply layer on carrier density and drift mobility of AlGaN/GaN/SiC high-electron-mobility transistors
Marso, Michel UL; Bernát, J.; Javorka, P. et al

in Applied Physics Letters (2004), 84 (2004)

Sheet carrier concentration and low-field drift mobility of intentionally undoped and modulation-doped AlGaN/GaN heterostructures on SiC substrate were evaluated by capacitance-voltage and channel ... [more ▼]

Sheet carrier concentration and low-field drift mobility of intentionally undoped and modulation-doped AlGaN/GaN heterostructures on SiC substrate were evaluated by capacitance-voltage and channel conductivity measurements. Sheet carrier concentration and average mobility at 0 V gate bias correspond to standard Hall results. Sheet carrier density increases from 6.831012 cm22 for the undoped sample up to 131013 cm22 for the device with the highest doping concentration, while the mobility decreases from 1800 to 1620 cm2/V s. The local mobility, on the other hand, depends only on the actual sheet carrier density and is not influenced by the doping concentration of the carrier supply layer. It reaches a maximum value of 2100 cm2/Vs at a carrier density of 331012 cm22. [less ▲]

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See detailInfluence of layer structure on performance of AlGaN/GaN High Electron Mobility Transistors before and after passivation
Bernát, J.; Javorka, P.; Fox, A. et al

in Journal of Electronic Materials (2004), 33((2004)), 436-439

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See detailMSM varactor diodes based on AlGaN/GaN/SiC HEMT layer structures
Marso, Michel UL; Bernát, J.; Javorka, P. et al

in Proc. 5th Intern. Conf. Advanced Semicon. Dev. & Microsystems ASDAM’04 (2004)

The influence of a carrier supply layer on the electrical properties of MSM diodes based on AlGaN/GaN HEMT layer structures is investigated. The voltage dependence of the Schottky contact capacitance ... [more ▼]

The influence of a carrier supply layer on the electrical properties of MSM diodes based on AlGaN/GaN HEMT layer structures is investigated. The voltage dependence of the Schottky contact capacitance allows the use of the device as varactor diode with CMAX / CMIN ratios up to 17, tuneable by contact geometry. The carrier supply doping determines the sheet carrier density of the twodimensional electron gas channel, which is responsible for the transition voltage and the series resistance of the MSM diode. A device based on the highest doped layer structure shows a cutoff frequency as high as 65 GHz. [less ▲]

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See detailInfluence of doping density on small and large signal characteristics of AlGaN/GaN/SiC HEMTs
Fox, A.; Marso, Michel UL; Bernát, J. et al

in Proc. 5th Intern. Conf. Advanced Semicon. Dev. & Microsystems ASDAM’04 (2004)

The small signal S-parameter and load pull measurements on AlGaN/GaN HEMTs with different doping densities are reported. The cut-off frequencies ft and fmax of 38 and 67 GHz respectively, and the maximal ... [more ▼]

The small signal S-parameter and load pull measurements on AlGaN/GaN HEMTs with different doping densities are reported. The cut-off frequencies ft and fmax of 38 and 67 GHz respectively, and the maximal output powers of 4.9 and 3.8 W/mm at 2 and 7 GHz respectively, were achieved. The parameter extraction from small signal S-parameters shows an increase of gate-source capacitance and transconductance with the doping concentration and hence its influence on small signal (ft and fmax) and power performance. [less ▲]

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See detailInvestigation of buffer traps in an AlGaN/GaN/Si high electron mobility transistor by backgating current deep level transient spectroscopy
Marso, Michel UL; Wolter, M.; Javorka, P. et al

in Applied Physics Letters (2003), 82

The influence of a substrate voltage on the dc characteristics of an AlGaN/GaN high electron mobility transistor ~HEMT! on silicon ~111! substrate is profited to investigate traps that are located between ... [more ▼]

The influence of a substrate voltage on the dc characteristics of an AlGaN/GaN high electron mobility transistor ~HEMT! on silicon ~111! substrate is profited to investigate traps that are located between the substrate and the two-dimensional electron gas channel. The transient of the drain current after applying a negative substrate voltage is evaluated in the temperature range from 30 to 100 °C. With this method, known as backgating current deep level transient spectroscopy, majority carrier traps with activation energy of 200 meV as well as minority carrier traps at 370 meV are identified. The experiments are performed on completed HEMTs, allowing the investigation of the influence of device fabrication technology. [less ▲]

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See detailMaterial and Device Issues of AlGaN/GaN HEMTs on Silicon Substrates
Javorka, P.; Alam, A.; Marso, Michel UL et al

in Proceedings of the MRS Fall Meeting, Boston 2002 (2003)

Results on the preparation and properties of AlGaN/GaN HEMTs on silicon substrates are presented and selected issues related to the material structure and device performance devices are discussed ... [more ▼]

Results on the preparation and properties of AlGaN/GaN HEMTs on silicon substrates are presented and selected issues related to the material structure and device performance devices are discussed. Virtually crack-free AlGaN/GaN heterostructures (xAlN ≅ 0.25), with low surface roughness (rms of 0.64 nm), ns ≅ 1×1013 cm-2 and μ ≅ 1100 cm2/V s at 300 K, were grown by LP-MOVPE on 2-inch (111)Si substrates. HEMT devices with Lg = 0.3−0.7 μm were prepared by conventional device processing steps. Photoionization spectroscopy measurements have shown that a trap level of 1.85 eV, additional to two levels of 2.9 and 3.2 eV found before on GaN-based HEMTs on sapphire, is present in the structures investigated. Self-heating effects were studied by means of temperature dependent dc measurements. The channel temperature of a HEMT on Si increases with dissipated power much slower than for similar devices on sapphire substrate (e.g. reaches 95 and 320 °C on Si and sapphire, respectively, for 6 W/mm power). Prepared AlGaN/GaN/Si HEMTs exhibit saturation currents up to 0.91 A/mm, a good pinch-off, peak extrinsic transconductances up to 150 mS/mm and static heat dissipation capability up to ~16 W/mm. Unity current gain frequencies fT up to 21 and 32 GHz were obtained on devices with gate length of 0.7 and 0.5 μm, respectively. The saturation current and fT values are comparable to those known for similar devices using sapphire and SiC substrates. Properties of AlGaN/GaN/Si HEMTs investigated show that this technology brings a prospect for commercial application of high power rf devices. [less ▲]

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See detailInfluence of SiO/sub 2/ and Si/sub 3/N/sub 4/ passivation on AlGaN/GaN/Si HEMT performance,
Javorka, P.; Bernát, J.; Fox, A. et al

in Electronics Letters (2003), 39((2003)), 1155-1157

Different influence of SiO2 and Si3N4 passivation on performance of AlGaN=GaN=Si HEMTs is reported. DC characteristics are less enhanced by using SiO2 than Si3N4. This is in agreement with carrier ... [more ▼]

Different influence of SiO2 and Si3N4 passivation on performance of AlGaN=GaN=Si HEMTs is reported. DC characteristics are less enhanced by using SiO2 than Si3N4. This is in agreement with carrier concentration changes after passivation, as follows from Hall data. Small signal RF performance is degraded after applying SiO2 and enhanced after Si3N4 passivation, e.g. for unpassivated devices fTffi17 GHz which decreased to 9 GHz and increased to 28 GHz for SiO2 and Si3N4 respectively. The fmax=fT ratio has not changed after passivation. [less ▲]

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See detailPeculiarities of low frequency noise in GaN-based high electron mobility transistors
Vitusevich, S. A.; Petrychuk, M. V.; Klein, N. et al

in Proc. 17th Internat. Conf. Noise and Fluctuations ICNF (2003)

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See detailInfluence of doping concentration on DC and RF performance of AlGaN/GaN HEMTs on silicon substrate
Marso, Michel UL; Javorka, P.; Dikme, Y. et al

in Physica Status Solidi A. Applications and Materials Science (2003), (1), 179-182

AlGaN/GaN HEMTs with different carrier supply layers are fabricated on Si substrate, using MOVPE growth technique. The influence of the carrier supply doping concentration on the HEMT properties is ... [more ▼]

AlGaN/GaN HEMTs with different carrier supply layers are fabricated on Si substrate, using MOVPE growth technique. The influence of the carrier supply doping concentration on the HEMT properties is investigated by Hall measurements and by electrical DC and RF characterisation of transistor devices. Hall mobility is found to decrease with increasing sheet concentration, while the gate leakage current increases. The device with the highest carrier supply doping concentration of 1019 cm–3 is provided with a GaN cap layer to reduce gate leakage. The transistors based on modulation doped layer structures show much higher DC performance than the undoped device. Best RF properties are obtained for a doping level of 5 × 1018 cm–3. High frequency measurements exhibit fT and fMAX values of 35 GHz and 37 GHz, respectively, for devices with 300 nm gate length. [less ▲]

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See detailEffect of surface passivation on performance of AlGaN/GaN/Si HEMTs
Bernát, J.; Javorka, P.; Fox, A. et al

in Solid-State Electronics (2003), 47((2003)), 2097-2103

Performance of intentionally undoped and doped AlGaN/GaN/Si high electron mobility transistors (HEMTs) before and after passivation with SiO2 and Si3N4 is investigated. Hall effect measurements show ... [more ▼]

Performance of intentionally undoped and doped AlGaN/GaN/Si high electron mobility transistors (HEMTs) before and after passivation with SiO2 and Si3N4 is investigated. Hall effect measurements show higher impact of Si3N4 than SiO2 passivation on the carrier concentration increase in the channel. Improvements in DC performance of HEMTs after passivation with SiO2 and Si3N4 correspond to the changes in sheet carrier concentration. Small signal microwave characterisation shows a decrease (from 18.6 to 9 GHz) and an increase (from 18.4 to 28.8 GHz) of the current gain cut off frequency after SiO2 and Si3N4 passivation, respectively. Similar effect of passivation is found in microwave power changes––only about a half of the power is obtained after SiO2 passivation but more than doubled power results from Si3N4 passivation, measured at 2 GHz. Higher density of interface states for SiO2 than Si3N4 passivation is supposed to be responsible for these effects. However, for an optimal design of GaN-based power devices additional studies related to the interface between a passivation layer and GaN are needed. [less ▲]

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See detailMaterial and Device Issues of AlGaN/GaN HEMTs on Silicon Substrates
Javorka, P.; Alam, A.; Marso, Michel UL et al

in Microelectronics Journal (2003), 34

Selected material and device issues related to the performance of AlGaN/GaN HEMTs on (111) Si substrates are reported. It is shown that these devices can sustain significantly higher dc power (16 W/mm ... [more ▼]

Selected material and device issues related to the performance of AlGaN/GaN HEMTs on (111) Si substrates are reported. It is shown that these devices can sustain significantly higher dc power (16 W/mm) than those grown on sapphire. Consequently smaller degradation in the device performance at higher temperatures (up to 400 8C) is demonstrated. Photoionisation spectroscopy reveals trap level of 1.85 eV, additional to two another levels found before in GaN-based HEMTs prepared on sapphire. Thus, AlGaN/GaN HEMTs on Si substrates demonstrate the viability of this technology for commercial application of high power rf devices. [less ▲]

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See detailConductivity and Hall effect measurements on intentionally undoped and doped AlGaN/GaN heterostructures before and after passivation,
Bernat, J.; Javorka, P.; Marso, Michel UL et al

in Applied Physics Letters (2003), 83((2003)), 5455

Conductivity and Hall effect measurements were performed before and after Si3N4 passivation of intentionally undoped and doped AlGaN/GaN heterostructures on Si and SiC substrates. An increase of the sheet ... [more ▼]

Conductivity and Hall effect measurements were performed before and after Si3N4 passivation of intentionally undoped and doped AlGaN/GaN heterostructures on Si and SiC substrates. An increase of the sheet carrier density ~up to ;30%! and a slight decrease of the electron mobility ~less than 10%! are found in all samples after passivation. The passivation induced sheet carrier density is 1.5– 231012 cm22 in undoped samples and only 0.731012 cm22 in 5–1031018 cm23 doped samples. The decrease of the electron mobility after passivation is slightly lower in highly doped samples. The channel conductivity in both types of unpassivated samples on Si and SiC substrates increases with an increase in doping density. After passivation, a well-resolved increase of channel conductivity is observed in the undoped or lightly doped samples and nearly the same channel conductivity results in the highly doped samples. [less ▲]

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See detailBackgating high-current and breakdown characterisation of AlGaN/GaN HEMTs on silicon substrates
Kuzmik, J.; Blaho, M.; Pogany, D. et al

in Proceedings of the ESSDERC 2003. Estoril, Portugal (2003)

Backgating effect as well as breakdown and high-current performance of AlGaN/GaN HEMTs on silicon substrates are studied. The material structure of investigated devices differ in the thickness of ... [more ▼]

Backgating effect as well as breakdown and high-current performance of AlGaN/GaN HEMTs on silicon substrates are studied. The material structure of investigated devices differ in the thickness of stressrelaxing intermediate layer sequence (~1 μm and ~2.5 μm thick). It is shown that the transistor backgating effect is reduced for the thicker sequence. Similarly, the reverse gate current is two orders of the magnitude lower and the gate-drain breakdown voltage increases substantially in devices with the thicker sequence. Increase from ~40 V to ~160 V of the HEMT blocking capability measured under electrostatic discharge-like conditions is also observed. [less ▲]

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See detailMSM Diodes Based on an AlGaN/GaN HEMT Layer Structure for Varactor and Photodiode Application
Marso, Michel UL; Bernát, J.; Wolter, M. et al

in , Proc. 4th Intern. Conf. Advanced Semicon. Dev. & Microsystems (2002)

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See detailAlGaN/GaN HEMTs on (111) Silicon Substrates
Javorka, P.; Alam, A.; Wolter, M. et al

in IEEE Electron Device Letters (2002), 23(2002), 4-6

AlGaN/GaN HEMTs on silicon substrates have been fabricated and their static and small-signal RF characteristics investigated. The AlGaN/GaN material structures were grown on (111) p-Si by LP-MOVPE ... [more ▼]

AlGaN/GaN HEMTs on silicon substrates have been fabricated and their static and small-signal RF characteristics investigated. The AlGaN/GaN material structures were grown on (111) p-Si by LP-MOVPE. Devices exhibit a saturation current of 0.91 A/mm, a good pinchoff and a peak extrinsic transconductance of 122 mS/mm. A unity current gain frequency of 12.5 GHz and fmax/fT=0.83 were obtained. The highest saturation current reported so far, static output characteristics of up to 20 V and breakdown voltage at pinchoff higher than 40 V demonstrate that the devices are capable of handling 16 W/mm static heat dissipation. [less ▲]

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See detailAnnealing of Schottky contacts deposited on dry etched AlGaN/GaN,
Kuzmík, J.; Javorka, P.; Marso, Michel UL et al

in Semiconductor Science & Technology (2002), 17((2002).), 76-78

The influence of annealing on properties of Pt Schottky contacts deposited on the electron cyclotron resonance plasma etched surface of an AlGaN/GaN heterostructure has been investigated. It is found that ... [more ▼]

The influence of annealing on properties of Pt Schottky contacts deposited on the electron cyclotron resonance plasma etched surface of an AlGaN/GaN heterostructure has been investigated. It is found that rapid thermal annealing (450 ◦C and 40 s in nitrogen gas), performed after metal deposition, allows for the preparation of Schottky contacts with similar or better properties than those obtained on a non-etched surface. This procedure is suitable for the realization of recessed high-quality Schottky contacts of AlGaN/GaN HEMTs. [less ▲]

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See detailAlGaN/GaN HEMTs on Silicon Substrates with f¬T of 32/20 GHz and fmax of 27/22 GHz for 0.5/0.7 µm gate length,
Javorka, P.; Alam, A.; Fox, A. et al

in Electronics Letters (2002), 38(2002), 288-289

AlGaN/GaN HEMTs on silicon substrates have been realised and their static and small signal characteristics investigated. The AlGaN/GaN (x=0.23) material structures were grown on (111) p-Si by LP-MOVPE ... [more ▼]

AlGaN/GaN HEMTs on silicon substrates have been realised and their static and small signal characteristics investigated. The AlGaN/GaN (x=0.23) material structures were grown on (111) p-Si by LP-MOVPE. Devices exhibit a saturation current density of 0.53 to 0.68 A/mm and a peak extrinsic transconductance of 110 mS/mm. A unity gain frequency of 20 and 32 GHz and a maximum frequency of oscillation of 22 and 27 GHz are obtained for devices with a gate length of 0.7 and 0.5 mm, respectively. These values are the highest reported so far on AlGaN=GaN=Si HEMTs and are comparable to those known for devices using sapphire and SiC substrates. [less ▲]

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