References of "Gregušová, D"
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See detailMonolithic Integration of Ultrafast Photodetector and MESFET in the GaN Material System
Mikulics, M.; Kordoš, P.; Gregušová, D. et al

in IEEE Photonics Technology Letters (2011), 23(17), 1189-1191

We have fabricated and characterized ultrafast metal–semiconductor–metal (MSM) photodetectors integrated with metal–semiconductor–field-effect-transistors (MESFETs) integrated in coplanar strip lines in ... [more ▼]

We have fabricated and characterized ultrafast metal–semiconductor–metal (MSM) photodetectors integrated with metal–semiconductor–field-effect-transistors (MESFETs) integrated in coplanar strip lines in the GaN/AlN/SiC material system. We recorded electrical transients of the single photodetector as short as 0.9 ps wide by optoelectric pump–probe measurements using 360-nm-wavelength and 100-fs-duration laser pulses. Electric photoresponse transients of the photodetector with 6-mV peak amplitude were amplified by the MESFET, resulting in 4-ps-wide and 35-mV peak amplitude signals. This monolithically integrated optoelectronic circuit is presented as a potential candidate for high-speed ultraviolet optoelectronics [less ▲]

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See detailCharacterization of AlGaN/GaN MOSHFETs with Al2O3 as Gate Oxide,
Gregušová, D.; Stoklas, R.; Čičo, K. et al

in Physica Status Solidi C. Current Topics in Solid State Physics (2007), 4 (2007)

We report on AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOSHFETs) with MOCVD deposited Al2O3 as a gate oxide. Properties of MOSHFETs with 9 nm and 14 nm thick Al2O3 are ... [more ▼]

We report on AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOSHFETs) with MOCVD deposited Al2O3 as a gate oxide. Properties of MOSHFETs with 9 nm and 14 nm thick Al2O3 are compared with conventional HFETs prepared simultaneously on the same layer structure. Lower gate leakage current (~10−5 A/mm at −10 V) and higher saturated drain current (up to 40%) are obtained for MOSHFETs than those for HFETs. In contradiction to previously reported data, the extrinsic transconductance for MOSHFETs is also higher (up to 37% of peak values) than that for HFET. This indicates on semi-conductive rather than insulating properties of Al2O3 gate oxide. Pulsed I−V measurements (pulse width 1 μs) yielded lower but still measurable current collapse in MOSHFETs compared to HFETs. Nevertheless, obtained results show that Al2O3 gate oxide, after optimising its microstructure and thickness, can be preferable for the preparation of AlGaN/GaN MOSHFETs. [less ▲]

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See detailComparative study on unpassivated and passivated AlGaN/GaN HFETs and MOSHFETs
Heidelberger, G.; Bernát, J.; Gregušová, D. et al

in Physica Status Solidi A. Applications and Materials Science (2006), 203(7), 1876-1881

In this comparative study we investigate AlGaN/GaN-based unpassivated and passivated HFETs and MOSHFETs with regards to DC-, RF-, and power-performance. For optimal comparability, all devices emanate from ... [more ▼]

In this comparative study we investigate AlGaN/GaN-based unpassivated and passivated HFETs and MOSHFETs with regards to DC-, RF-, and power-performance. For optimal comparability, all devices emanate from the same wafer consisting of a SiC-substrate, a 3 μm GaN- and a 30 nm Al0.28Ga0.72N-layer. Devices are processed simultaneously to a large extend. Passivated devices are coated with a 10 nm thick SiO2-layer between the electrodes, MOSHFETs contain a 10 nm thick SiO2-layer serving as gate-insulator underneath the gate and as conventional passivation-layer between the electrodes. Unpassivated devices serve as reference. We present empirical evidence that MOSHFETs outperform both the conventional and the passivated HFETs with respect to DC-, RF-, and power-performance, and we point out the different mechanisms responsible for the behaviour of the devices. [less ▲]

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See detailImpact of surface treatment under the gate on the current collapse of unpassivated AlGaN/GaN heterostructure field-effect transistors
Kordoš, P.; Bernát, J.; Gregušová, D. et al

in Semiconductor Science & Technology (2006), 21 (2006)

Unpassivated GaN/AlGaN/GaN/SiC heterostructure field-effect transistors were fabricated on intentionally undoped and 5 × 1018 cm−3 modulationdoped material structures. The influence of surface treatment ... [more ▼]

Unpassivated GaN/AlGaN/GaN/SiC heterostructure field-effect transistors were fabricated on intentionally undoped and 5 × 1018 cm−3 modulationdoped material structures. The influence of surface treatment before gate metallization on the gate leakage and drain current collapse of the devices was observed. In the case of a short HCl treatment (∼5 s), a relatively small gate leakage (<10−6A mm−1 at −6 V gate bias) but large current collapse (∼30% after applying 5 μs wide pulses) were measured. On the other hand, devices with a longer surface treatment (15–20 s) showed an increased gate leakage (>10−4A mm−1) and a simultaneously negligible current collapse (<5%). This effect is qualitatively similar in devices prepared on the undoped and doped heterostructures. It is assumed that a thin interfacial oxide layer under the gate might be responsible for a lower leakage current and a larger current collapse of the devices. [less ▲]

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See detailSiO2 /AlGaN/GaN MOSHFET with 0.7 µm gate-length and fmax / fT of 40/24 GHz
Bernát, J.; Gregusová, D.; Heidelberger, G. et al

in Electronics Letters (2005), 41(11), 667-668

The performance of SiO2/AlGaN/GaN MOSHFETs is described. The C–V measurements showed slight increase in sheet carrier density after applying 12 nm-thick PECVD SiO2. The devices exhibited gate leakage ... [more ▼]

The performance of SiO2/AlGaN/GaN MOSHFETs is described. The C–V measurements showed slight increase in sheet carrier density after applying 12 nm-thick PECVD SiO2. The devices exhibited gate leakage current of 5 .10 ^-10 A/mm. Small-signal RF characterisation of 0.7 mm gate length devices yielded an fT of 24 GHz and an fmax of 40 GHz, which are comparable to those typical for state-of-the-art AlGaN/GaN HFETs. [less ▲]

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