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See detailUltrafast metal-semiconductor-metal photodetectors on low-temperature-grown GaN
Mikulics, M.; Marso, Michel UL; Javorka, P. et al

in Applied Physics Letters (2005), 86(21), 211110

We have fabricated and characterized ultrafast metal-semiconductor-metal photodetectors based on low-temperature-grown sLTd GaN. The photodetector devices exhibit up to 200 kV/cm electric breakdown fields ... [more ▼]

We have fabricated and characterized ultrafast metal-semiconductor-metal photodetectors based on low-temperature-grown sLTd GaN. The photodetector devices exhibit up to 200 kV/cm electric breakdown fields and subpicosecond carrier lifetime. We recorded as short as 1.4-ps-wide electrical transients using 360-nm-wavelength and 100-fs-duration laser pulses, that is corresponding to the carrier lifetime of 720 fs in our LT GaN material. [less ▲]

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See detailDC and Pulsed Behaviour of Undoped and Doped AlGaN/GaN/SiC HEMTs before and after Si3N4 passivation
Bernát, J.; Marso, Michel UL; Fox, A. et al

in Proc. 5th Intern. Conf. Advanced Semicon. Dev. & Microsystems ASDAM’04 (2004)

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See detailAn optimization of terahertz local oscillators based on LT-GaAs technology
Mayorga, I. C.; Mikulics, M.; Schmitz, A. et al

in SPIE - The International Society for Optical Engineering (2004), 5498 (2004)

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See detailGeneration of 1 THz radiation by photomixing in low-temperature-grown MBE GaAs
Mikulics, M.; Camara, I.; Marso, Michel UL et al

in Proc. 5th Intern. Conf. Advanced Semicon. Dev. & Microsystems ASDAM’04 (2004)

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See detailGaN Nanocolumns on Si(111) Grown b Molecular Beam Epitaxy
Calarco, Raffaella; Marso, Michel UL; Meijers, R. et al

in Proc. 5th Intern. Conf. Advanced Semicon. Dev. & Microsystems ASDAM’04 (2004)

GaN nanocolumns are reproducibly grown by plasma-assisted molecular beam epitaxy on Si(111). The nanocolumn density and diameter, 20–150 nm, are controlled by means of the III/V ratio. The nanocolumns ... [more ▼]

GaN nanocolumns are reproducibly grown by plasma-assisted molecular beam epitaxy on Si(111). The nanocolumn density and diameter, 20–150 nm, are controlled by means of the III/V ratio. The nanocolumns grow parallel to the [111] direction of the Si substrate. The columns have been transferred to a Si(100) substrate covered with a layer of 300nm SiO2; single nanowire devices have been fabricated using finger shaped electrical contacts (Ti/Au) obtained by e-beam patterning technique. The electrical transport properties of the resulting metal–semiconductor–metal nanostructures are analyzed by means of current– voltage measurements with and without UV-illumination. [less ▲]

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See detailLarge-area traveling-wave LT-GaAs photomixers for LO application
Michael, E. A.; Mikulics, M.; Marso, Michel UL et al

in SPIE - The International Society for Optical Engineering (2004), 5498 (2004)

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See detailVertical Double-Gate MOSFETs
Moers, J.; Trellenkamp, St; Marso, Michel UL et al

in Proc. 5th Intern. Conf. Advanced Semicon. Dev. & Microsystems ASDAM’04 (2004)

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See detailNitrogen implanted GaAs for ultrafast photodetectors and photomixers
Mikulics, M.; Wolter, M. J.; Marso, Michel UL et al

in Proc. 5th Intern. Conf. Advanced Semicon. Dev. & Microsystems ASDAM’04 (2004)

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See detailPeculiarities of low frequency noise in GaN-based high electron mobility transistors
Vitusevich, S. A.; Petrychuk, M. V.; Klein, N. et al

in Proc. 17th Internat. Conf. Noise and Fluctuations ICNF (2003)

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See detailInfluence of SiO/sub 2/ and Si/sub 3/N/sub 4/ passivation on AlGaN/GaN/Si HEMT performance,
Javorka, P.; Bernát, J.; Fox, A. et al

in Electronics Letters (2003), 39((2003)), 1155-1157

Different influence of SiO2 and Si3N4 passivation on performance of AlGaN=GaN=Si HEMTs is reported. DC characteristics are less enhanced by using SiO2 than Si3N4. This is in agreement with carrier ... [more ▼]

Different influence of SiO2 and Si3N4 passivation on performance of AlGaN=GaN=Si HEMTs is reported. DC characteristics are less enhanced by using SiO2 than Si3N4. This is in agreement with carrier concentration changes after passivation, as follows from Hall data. Small signal RF performance is degraded after applying SiO2 and enhanced after Si3N4 passivation, e.g. for unpassivated devices fTffi17 GHz which decreased to 9 GHz and increased to 28 GHz for SiO2 and Si3N4 respectively. The fmax=fT ratio has not changed after passivation. [less ▲]

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See detailInfluence of doping concentration on DC and RF performance of AlGaN/GaN HEMTs on silicon substrate
Marso, Michel UL; Javorka, P.; Dikme, Y. et al

in Physica Status Solidi A. Applications and Materials Science (2003), (1), 179-182

AlGaN/GaN HEMTs with different carrier supply layers are fabricated on Si substrate, using MOVPE growth technique. The influence of the carrier supply doping concentration on the HEMT properties is ... [more ▼]

AlGaN/GaN HEMTs with different carrier supply layers are fabricated on Si substrate, using MOVPE growth technique. The influence of the carrier supply doping concentration on the HEMT properties is investigated by Hall measurements and by electrical DC and RF characterisation of transistor devices. Hall mobility is found to decrease with increasing sheet concentration, while the gate leakage current increases. The device with the highest carrier supply doping concentration of 1019 cm–3 is provided with a GaN cap layer to reduce gate leakage. The transistors based on modulation doped layer structures show much higher DC performance than the undoped device. Best RF properties are obtained for a doping level of 5 × 1018 cm–3. High frequency measurements exhibit fT and fMAX values of 35 GHz and 37 GHz, respectively, for devices with 300 nm gate length. [less ▲]

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See detailInvestigation of buffer traps in an AlGaN/GaN/Si high electron mobility transistor by backgating current deep level transient spectroscopy
Marso, Michel UL; Wolter, M.; Javorka, P. et al

in Applied Physics Letters (2003), 82

The influence of a substrate voltage on the dc characteristics of an AlGaN/GaN high electron mobility transistor ~HEMT! on silicon ~111! substrate is profited to investigate traps that are located between ... [more ▼]

The influence of a substrate voltage on the dc characteristics of an AlGaN/GaN high electron mobility transistor ~HEMT! on silicon ~111! substrate is profited to investigate traps that are located between the substrate and the two-dimensional electron gas channel. The transient of the drain current after applying a negative substrate voltage is evaluated in the temperature range from 30 to 100 °C. With this method, known as backgating current deep level transient spectroscopy, majority carrier traps with activation energy of 200 meV as well as minority carrier traps at 370 meV are identified. The experiments are performed on completed HEMTs, allowing the investigation of the influence of device fabrication technology. [less ▲]

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See detailInvestigation of traps in AlGaN/GaN HEMTs on silicon substrate
Wolter, M.; Marso, Michel UL; P.Javorka, J. et al

in Physica Status Solidi C. Current Topics in Solid State Physics (2003), (7), 2360-2363

Deep levels in AlGaN/GaN heterostructures are known to be responsible for trapping processes like current collapse or dispersion. In order to investigate these processes we performed different ... [more ▼]

Deep levels in AlGaN/GaN heterostructures are known to be responsible for trapping processes like current collapse or dispersion. In order to investigate these processes we performed different measurements on HEMTs fabricated with heterostructures grown on silicon substrate. First by photoionization spectroscopy we found three different traps with activation energies of about 2.1 eV, 2.9 eV and 3.2 eV. Secondly, the temperature dependent relaxation of the drain current was investigated by the backgating current deep level transient spectroscopy (DLTS) method. Hereby we detected majority and minority carrier traps in the GaN buffer at the energies EV + 0.41 eV and EC – 0.55 eV, respectively. The latter energy can be attributed to the well known “E2” level in GaN. [less ▲]

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See detailEffect of surface passivation on performance of AlGaN/GaN/Si HEMTs
Bernát, J.; Javorka, P.; Fox, A. et al

in Solid-State Electronics (2003), 47((2003)), 2097-2103

Performance of intentionally undoped and doped AlGaN/GaN/Si high electron mobility transistors (HEMTs) before and after passivation with SiO2 and Si3N4 is investigated. Hall effect measurements show ... [more ▼]

Performance of intentionally undoped and doped AlGaN/GaN/Si high electron mobility transistors (HEMTs) before and after passivation with SiO2 and Si3N4 is investigated. Hall effect measurements show higher impact of Si3N4 than SiO2 passivation on the carrier concentration increase in the channel. Improvements in DC performance of HEMTs after passivation with SiO2 and Si3N4 correspond to the changes in sheet carrier concentration. Small signal microwave characterisation shows a decrease (from 18.6 to 9 GHz) and an increase (from 18.4 to 28.8 GHz) of the current gain cut off frequency after SiO2 and Si3N4 passivation, respectively. Similar effect of passivation is found in microwave power changes––only about a half of the power is obtained after SiO2 passivation but more than doubled power results from Si3N4 passivation, measured at 2 GHz. Higher density of interface states for SiO2 than Si3N4 passivation is supposed to be responsible for these effects. However, for an optimal design of GaN-based power devices additional studies related to the interface between a passivation layer and GaN are needed. [less ▲]

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See detailWet low-temperature gate oxidation for nanoscale vertical field-effect transistors,
Goryll, M.; Moers, J.; Trellenkamp, S. et al

in Physica E (2003), 19(2003), 18-22

In this work, we present an approach towards improving a vertical eld-e ect transistor based on a narrow mesa that is capable of showing complete channel inversion. Contrary to similar concepts it does ... [more ▼]

In this work, we present an approach towards improving a vertical eld-e ect transistor based on a narrow mesa that is capable of showing complete channel inversion. Contrary to similar concepts it does not necessarily require the use of an SOI substrate due to the chosen vertical layer sequence. An important issue during process flow is the limited thermal budget in order to preserve the desired channel length. Here a low-temperature wet oxidation process is investigated to prevent dopant di ffusion in early process steps. Results on the thickness homogeneity and electrical properties of this gate oxide will be presented and discussed. [less ▲]

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See detailInvestigation of current collapse in doped and undoped AlGaN/GaN HEMTs
Wolter, M.; Javorka, P.; Marso, Michel UL et al

in Proc. 4th Intern. Conf. Advanced Semicon. Dev. & Microsystems (2002)

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See detailPhotoionization spectroscopy of traps in doped and undoped AlGaN/GaN HEMTs
Wolter, M.; Javorka, P.; Marso, Michel UL et al

in Physica Status Solidi C. Current Topics in Solid State Physics (2002), (1), 82-85

Deep-level defects and surface states are supposed to be responsible for the limitation of AlGaN/GaN high electron mobility transistor (HEMT) performance. In order to investigate the influence of these ... [more ▼]

Deep-level defects and surface states are supposed to be responsible for the limitation of AlGaN/GaN high electron mobility transistor (HEMT) performance. In order to investigate the influence of these traps, photoionization spectroscopy was used to study doped and undoped HEMTs grown on sapphire in different metalorganic vapour-phase epitaxy reactors. This measurement technique is based on the optical reversion of the current collapse and it allows one to determine photoionization cross-sections of the participating traps. For doped and undoped HEMTs nearly the same two defect levels with excitation energies of 3.2 eV and 2.9 eV were determined. By varying the source–gate voltage it was found that the photoionization cross-section is reduced for positive gate bias, i.e. the virtual gate on the gate–drain access region is partially neutralized due to the removal of trapped electrons from surface states. [less ▲]

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See detailThin low-temperature gate oxides for vertical field-effect transistor, ,
Goryll, M.; Moers, J.; Trellenkamp, St et al

in Proc. 4th Intern. Conf. Advanced Semicon. Dev. & Microsystems (2002)

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See detailPhotoionization spectroscopy of traps in AlGaN/GaN HEMTs
Wolter, M.; Javorka, P.; Marso, Michel UL et al

in Journal of Electronic Materials (2002), 31(12), 1321-1324

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See detailAlGaN/GaN HEMTs on (111) Silicon Substrates
Javorka, P.; Alam, A.; Wolter, M. et al

in IEEE Electron Device Letters (2002), 23(2002), 4-6

AlGaN/GaN HEMTs on silicon substrates have been fabricated and their static and small-signal RF characteristics investigated. The AlGaN/GaN material structures were grown on (111) p-Si by LP-MOVPE ... [more ▼]

AlGaN/GaN HEMTs on silicon substrates have been fabricated and their static and small-signal RF characteristics investigated. The AlGaN/GaN material structures were grown on (111) p-Si by LP-MOVPE. Devices exhibit a saturation current of 0.91 A/mm, a good pinchoff and a peak extrinsic transconductance of 122 mS/mm. A unity current gain frequency of 12.5 GHz and fmax/fT=0.83 were obtained. The highest saturation current reported so far, static output characteristics of up to 20 V and breakdown voltage at pinchoff higher than 40 V demonstrate that the devices are capable of handling 16 W/mm static heat dissipation. [less ▲]

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